Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions
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===Aligner: Maskless 03=== | ===Aligner: Maskless 03=== | ||
The Aligner: Maskless 03 has a 405 nm laser light source with a FWHM of ~1 nm. | The Aligner: Maskless 03 has a 405 nm laser light source with a FWHM of ~1 nm. All exposures on this tool are made using the pneumatic autofocus system. | ||
'''Quality control'''<br> | '''Quality control'''<br> | ||
Please note that the values listed below are <i>'''not'''</i> routinely tested as part of quality control, except for the resist AZ 5214E. | Please note that the values listed below are <i>'''not'''</i> routinely tested as part of quality control, except for the resist AZ 5214E. | ||
{| | {| class="wikitable" | ||
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! !! Date !! Operator !! Film thickness !! Exposure mode !! Dose !! Defoc !! Resolution !! Comments | |||
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|- | ! scope=row| AZ MIR 701 | ||
| 2025-10-20 || jehem || 1.5 µm || Quality || 175 mJ/cm<sup>2</sup> || -1 || 1 µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle<br><br>Tested using dehydration reducing measures | |||
|- | |- | ||
! scope=row| AZ 5214E | |||
| 2025-09-02 || taran || 1.5 µm || Quality|| 75 mJ/cm<sup>2</sup> || 1 || 1 µm || See QC data for latest values<br><br>Development: 60 s puddle | |||
|- | |- | ||
| | ! scope=row| AZ 5214E<br>Image reversal | ||
| 2023-06-30 || jehem || 2.2 µm || Quality|| 50 mJ/cm<sup>2</sup> || 0 || 1 µm || '''Not under regular quality control'''<br><br>Reversal bake: 60 s @ 110°C<br>Flood exposure: 500 mJ/cm<sup>2</sup><br>Development: 60 s puddle | |||
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| 1 µm | |||
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Development: 60 s puddle | |||
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! scope=row| AZ nLOF 2020 | |||
| 2023-06-30 || jehem || 2 µm || Quality|| 9000 mJ/cm<sup>2</sup> || 2 || 1 µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle<br><br><span style="color:red">'''Due to the high dose required on this tool, it is recommended to process nLOF on tools with a more appropriate exposure light source'''</span> | |||
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| | ! scope=row| AZ 4562 | ||
| 2023-06-30 || jehem || 10 µm || Quality|| 550 mJ/cm<sup>2</sup> || 3 || ≤5 µm || '''Not under regular quality control'''<br><br>Priming: HMDS<BR>Rehydration after SB: none<br>Exposure: Single exposure<br>Degassing after exposure: none<br>Development: 5 x 60 s multi puddle | |||
| 2023-06-30 | |} | ||
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Development: 60 s puddle | |||
''' | '''New resists'''<br> | ||
As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. The following table contains only information about the new resist versions. | |||
'''Dehydration reducing measures used for testing AZ MiR 701:'''<br> | '''Dehydration reducing measures used for testing AZ MiR 701:'''<br> | ||
The CDA used for the pneumatic autofocus will dehydrate the resist. To reduce this effect, the writehead is parked far away from the write area while setting up the job for at least a few minutes, before starting the exposure. | The CDA used for the pneumatic autofocus will dehydrate the resist. To reduce this effect, the writehead is parked far away from the write area while setting up the job for at least a few minutes, before starting the exposure. | ||