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Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions

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Line 695: Line 695:
| 1 µm<br>Tested using dehydration reducing measures
| 1 µm<br>Tested using dehydration reducing measures
| PEB: 60s@110°C<br>Dev: SP60s
| PEB: 60s@110°C<br>Dev: SP60s
|-
|-
|-style="background:silver; color:black"
!AZ nLOF 2020
| 2023-06-30<br>jehem
| 2.0 µm
| 405
| Pneumatic
| Quality
| 9000 mJ/cm<sup>2</sup>
| 2
| 1 µm
|
PEB: 60s @ 100°C<br>
Dev: SP60s<br>
<span style="color:red">'''Due to the high dose required on this tool, it is recommended to process nLOF on tools with a more appropriate exposure light source'''</span>
|-
|-


Line 743: Line 726:
Flood exposure: 500mJ/cm<sup>2</sup><br>
Flood exposure: 500mJ/cm<sup>2</sup><br>
Dev: SP60s  
Dev: SP60s  
|-
|-
|-style="background:silver; color:black"
!AZ nLOF 2020
| 2023-06-30<br>jehem
| 2.0 µm
| 405
| Pneumatic
| Quality
| 9000 mJ/cm<sup>2</sup>
| 2
| 1 µm
|
PEB: 60s @ 100°C<br>
Dev: SP60s<br>
<span style="color:red">'''Due to the high dose required on this tool, it is recommended to process nLOF on tools with a more appropriate exposure light source'''</span>
|-
|-


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