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==Exposure dose for mask aligners==
==Exposure dose for mask aligners==
The exposure doses listed below are for ''generic'' good exposure results, and can be a compromise between getting good lines, as well as good dots, in both clear field and dark field exposures. The optimal dose for any given specific project, could be different from the listed values.
[[Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseMaskAligners|Information about the exposure dose for mask aligners can be found here.]]
 
All doses are for standard silicon wafers, unless otherwise stated. Development is done using 2.38% TMAH (AZ 726 MIF).
 
 
===Aligner: MA6-1===
The Aligner: MA6-1 has an i-line notch filter installed. This produces an exposure light peak around 365 nm with a FWHM of 7 nm.
 
'''Quality control'''<br>
Please note that the values listed in the table are <i>'''not'''</i> routinely tested as part of quality control.
 
{| class="wikitable"
|-
!  !! Date !! Operator !! Film thickness !! Exposure mode !! Dose !! Resolution !! Comments
|-
! scope=row| AZ MIR 701
| Long ago || ? || 1.5 µm || ? || 180 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle
|-
! scope=row| AZ MIR 701
| Long ago || ? || 2.0 µm || ? || 200 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle
|-
! scope=row| AZ MIR 701
| Long ago || ? || 4.0 µm || ? || 400 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle
|-
! scope=row| AZ 5214E
| Long ago || ? || 1.5 µm || ? || 72 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Development: 60 s puddle
|-
! scope=row| AZ 5214E
| Long ago || ? || 2.2 µm || ? || 80 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Development: 60 s puddle
|-
! scope=row| AZ 5214E
| Long ago || ? || 4.2 µm || ? || 160 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Development: 60 s puddle
|-
! scope=row| AZ 5214E<br>Image reversal
| Long ago || ? || 2.2 µm || ? || ? mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Reversal bake: 60 s @ 110°C<br>Flood exposure: 500 mJ/cm<sup>2</sup><br>Development: 60 s puddle
|-
! scope=row| AZ nLOF 2020
| Long ago || ? || 2.0 µm || ? || 121 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle<br><br>Side wall angle: ~15°<br>For smaller angle (~5°): develop 30 seconds instead
|-
! scope=row| AZ 4562
| Long ago || ? || 10 µm || ? || 510 mJ/cm<sup>2</sup> || ≤5 µm || '''Not under regular quality control'''<br><br>Priming: HMDS<BR>Rehydration after SB: none<br>Exposure: Multiple exposures with 15 s pauses is recommended<br>Degassing after exposure: none<br>Development: 5 x 60 s multi puddle
|}
 
'''New resists version in 2023'''<br>
As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. This table contains only information about the <i>old</i> resist versions.
 
<br clear="all" />
 
===Aligner: MA6-2===
The Aligner: MA6-2 has an i-line notch filter installed. This produces an exposure light peak around 365 nm with a FWHM of 7 nm.
 
'''Quality control'''<br>
Please note that the values listed in the table are <i>'''not'''</i> routinely tested as part of quality control.
 
{| class="wikitable"
|-
!  !! Date !! Operator !! Film thickness !! Exposure mode !! Dose !! Resolution !! Comments
|-
! scope=row| AZ MIR 701
| 2023-09-26 || taran || 1.5 µm || Hard contact || 150 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle
|-
! scope=row| AZ 5214E
| 2025-09-30 || jehem || 1.5 µm || Hard contact|| 90 mJ/cm<sup>2</sup> || 1.5 µm || '''Not under regular quality control'''<br><br>Development: 60 s puddle
|-
! scope=row| AZ 5214E<br>Image reversal
| 2023-01-11 || jehem || 2.2 µm || Hard contact|| 22 mJ/cm<sup>2</sup> || 2.0 µm || '''Not under regular quality control'''<br><br>Reversal bake: 60 s @ 110°C<br>Flood exposure: 500 mJ/cm<sup>2</sup><br>Development: 60 s puddle
|-
! scope=row| AZ nLOF 2020
| 2023-09-26 || taran || 2.0 µm || Hard contact || 121 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle
|-
! scope=row| AZ 4562
| 2021-12-08 || jehem || 10 µm || Soft contact|| 550 mJ/cm<sup>2</sup> || ≤5 µm || '''Not under regular quality control'''<br><br>Priming: HMDS<BR>Rehydration after SB: none<br>Exposure: Single exposure<br>Degassing after exposure: none<br>Development: 5 x 60 s multi puddle
|}
 
'''New resists version in 2023'''<br>
As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. This table contains only information about the new resist versions.
 
<br clear="all" />


==Exposure dose for maskless aligners==
==Exposure dose for maskless aligners==
The exposure doses listed below are for ''generic'' good exposure results, and can be a compromise between getting good lines, as well as good dots, in both clear field and dark field exposures. The optimal dose and achievable resolution for any given specific project, could be different from the listed values.
[[Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseMasklessAligners|Information about the exposure dose for maskless aligners can be found here.]]
 
All doses are for standard silicon wafers, unless otherwise stated. Development is done using 2.38% TMAH (AZ 726 MIF).
 
 
===Aligner: Maskless 01===
The Aligner: Maskless 01 has a 365 nm laser light source with a FWHM of ~1 nm. The test exposures on this tool were made using the pneumatic autofocus system.
 
'''Quality control'''<br>
Please note that the values listed in the table are <i>'''not'''</i> routinely tested as part of quality control, except for the resist AZ 5214E.
 
{| class="wikitable"
|-
!  !! Date !! Operator !! Film thickness !! Exposure mode !! Dose !! Defoc !! Resolution !! Comments
|-
! scope=row| AZ MIR 701
| 2025-10-16 || jehem || 1.5 µm || Fast || 325 mJ/cm<sup>2</sup> || -1 || 1.5 µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle<br><br>Tested using dehydration reducing measures
|-
! scope=row| AZ 5214E
| 2025-08-15 || taran || 1.5 µm || Fast|| 110 mJ/cm<sup>2</sup> || -1 || 1.75 µm || See QC data for latest values<br><br>Development: 60 s puddle
|-
! scope=row| AZ 5214E<br>Image reversal
| 2023-04-05 || jehem || 2.2 µm || Fast|| 20 mJ/cm<sup>2</sup><br><span style="color:red">possibly incorrect data</span> || -2<br><span style="color:red">possibly incorrect data</span> || 2.0 µm || '''Not under regular quality control'''<br><br>Reversal bake: 60 s @ 110°C<br>Flood exposure: 500 mJ/cm<sup>2</sup><br>Development: 60 s puddle
|-
! scope=row| AZ nLOF 2020
| 2023-07-06 || jehem || 2.0 µm || Fast || 180 mJ/cm<sup>2</sup> || 0 || 1.5 µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle
|-
! scope=row| AZ 4562
| 2023-04-05 || jehem || 10 µm || Fast|| 1050 mJ/cm<sup>2</sup><br><span style="color:red">possibly incorrect data</span> || -1<br><span style="color:red">possibly incorrect data</span> || ≤5 µm || '''Not under regular quality control'''<br><br>Priming: HMDS<BR>Rehydration after SB: none<br>Exposure: Single exposure<br>Degassing after exposure: none<br>Development: 5 x 60 s multi puddle
|}
 
'''New resists version in 2023'''<br>
As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. This table contains only information about the new resist versions.
 
'''Dehydration reducing measures used for testing AZ MiR 701:'''<br>
The CDA used for the pneumatic autofocus will dehydrate the resist. To reduce this effect, the writehead is parked far away from the write area while setting up the job for at least a few minutes, before starting the exposure.
 
<br clear="all" />
 
===Aligner: Maskless 02===
The Aligner: Maskless 02 has a 375 nm laser light source with a FWHM of ~1 nm. The test exposures on this tool were made using the optical autofocus system, unless otherwise specified.
 
'''Quality control'''<br>
Please note that the values listed in the table are <i>'''not'''</i> routinely tested as part of quality control, except for the resist AZ 5214E.
 
{| class="wikitable"
|-
!  !! Date !! Operator !! Film thickness !! Exposure mode !! Dose !! Defoc !! Resolution !! Comments
|-
! scope=row| AZ MIR 701
| 2023-08-21 || taran || 1.5 µm || Quality || 325 mJ/cm<sup>2</sup> || 1 || 1 µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle<br><br>Tested using dehydration reducing measures
|-
! scope=row| AZ 5214E
| 2024-12-09 || taran || 1.5 µm || Quality|| 100 mJ/cm<sup>2</sup> || 2 || 1.5 µm || See QC data for latest values<br><br>Development: 60 s puddle
|-
! scope=row| AZ 5214E<br>Image reversal
| 2023-04-17 || jehem || 2.2 µm || Quality|| 35 mJ/cm<sup>2</sup> || 0 || 1.5 µm || '''Not under regular quality control'''<br><br>Reversal bake: 60 s @ 110°C<br>Flood exposure: 500 mJ/cm<sup>2</sup><br>Development: 60 s puddle
|-
! scope=row| AZ nLOF 2020
| 2023-08-21 || taran || 2.0 µm || Quality || 450 mJ/cm<sup>2</sup> || 0 || 1.5 µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle
|-
! scope=row| AZ 4562
| 2023-04-19 || jehem || 10 µm || Quality|| 1150 mJ/cm<sup>2</sup> || 0 || ≤5 µm || '''Not under regular quality control'''<br><br>Priming: HMDS<BR>Rehydration after SB: none<br>Exposure: Single exposure<br>Degassing after exposure: none<br>Development: 5 x 60 s multi puddle
|}
 
'''New writehead'''<br>
As of 2023-03-21 the MLA2 has a new writehead installed, converting it from a write mode 1 tool to a write mode 2 tool. This makes all previous dose/defocus settings obsolete. This table contains only the dose/defocus values for the new writehead.
 
'''New resists version in 2023'''<br>
As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. This table contains only information about the new resist versions.
 
'''Dehydration reducing measures used for testing AZ MiR 701:'''<br>
The CDA used for the pneumatic autofocus will dehydrate the resist. To reduce this effect, the writehead is parked far away from the write area while setting up the job for at least a few minutes, before starting the exposure.
 
<br clear="all" />
 
===Aligner: Maskless 03===
The Aligner: Maskless 03 has a 405 nm laser light source with a FWHM of ~1 nm. The test exposures on this tool were made using the pneumatic autofocus system.
 
'''Quality control'''<br>
Please note that the values listed in the table are <i>'''not'''</i> routinely tested as part of quality control, except for the resist AZ 5214E.
 
{| class="wikitable"
|-
!  !! Date !! Operator !! Film thickness !! Exposure mode !! Dose !! Defoc !! Resolution !! Comments
|-
! scope=row| AZ MIR 701
| 2025-10-20 || jehem || 1.5 µm || Quality || 175 mJ/cm<sup>2</sup> || -1 || 1 µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle<br><br>Tested using dehydration reducing measures
|-
! scope=row| AZ 5214E
| 2025-09-02 || taran || 1.5 µm || Quality|| 75 mJ/cm<sup>2</sup> || 1 || 1 µm || See QC data for latest values<br><br>Development: 60 s puddle
|-
! scope=row| AZ 5214E<br>Image reversal
| 2023-06-30 || jehem || 2.2 µm || Quality|| 50 mJ/cm<sup>2</sup> || 0 || 1 µm || '''Not under regular quality control'''<br><br>Reversal bake: 60 s @ 110°C<br>Flood exposure: 500 mJ/cm<sup>2</sup><br>Development: 60 s puddle
|-
! scope=row| AZ nLOF 2020
| 2023-06-30 || jehem || 2 µm || Quality|| 9000 mJ/cm<sup>2</sup> || 2 || 1 µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle<br><br><span style="color:red">'''Due to the high dose required on this tool, it is recommended to process nLOF on tools with a more appropriate exposure light source'''</span>
|-
! scope=row| AZ 4562
| 2023-06-30 || jehem || 10 µm || Quality|| 550 mJ/cm<sup>2</sup> || 3 || ≤5 µm || '''Not under regular quality control'''<br><br>Priming: HMDS<BR>Rehydration after SB: none<br>Exposure: Single exposure<br>Degassing after exposure: none<br>Development: 5 x 60 s multi puddle
|}
 
'''New resists version in 2023'''<br>
As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. This table contains only information about the new resist versions.
 
'''Dehydration reducing measures used for testing AZ MiR 701:'''<br>
The CDA used for the pneumatic autofocus will dehydrate the resist. To reduce this effect, the writehead is parked far away from the write area while setting up the job for at least a few minutes, before starting the exposure.
 
<br clear="all" />


==Exposure dose when using AZ 351B developer (NaOH)==
==Exposure dose when using AZ 351B developer (NaOH)==
The exposure doses listed below are for ''generic'' good exposure results, and can be a compromise between getting good lines, as well as good dots, in both clear field and dark field exposures. The optimal dose for any given specific project, could be different from the listed values.
[[Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseNaOH|Information about the exposure dose when using AZ 351B developer can be found here.]]
 
All doses are for standard silicon wafers, unless otherwise stated. Development is done using AZ 351B developer (NaOH) diluted 1:5.
 
 
===Aligner: MA6-1===
The Aligner: MA6-1 has an i-line notch filter installed. This produces an exposure light peak around 365 nm with a FWHM of 7 nm.
 
'''Quality control'''<br>
Please note that the values listed in the table are <i>'''not'''</i> routinely tested as part of quality control.
 
{| class="wikitable"
|-
!  !! Date !! Operator !! Film thickness !! Exposure mode !! Dose !! Resolution !! Comments
|-
! scope=row| AZ 5214E
| Long ago || ? || 1.5 µm || ? || 70 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Development: 60 s submersion
|-
! scope=row| AZ 5214E
| Long ago || ? || 2.2 µm || ? || 72 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Development: 70 s submersion
|-
! scope=row| AZ 5214E
| Long ago || ? || 4.2 µm || ? || 160 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Development: 180 s submersion
|-
! scope=row| AZ 5214E<br>Image reversal
| Long ago || ? || 1.5 µm || ? || 30 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Reversal bake: 100 s @ 110°C<br>Flood exposure: 210 mJ/cm<sup>2</sup><br>Development: 60 s submersion
|-
! scope=row| AZ 5214E<br>Image reversal
| Long ago || ? || 2.2 µm || ? || 35 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Reversal bake: 100 s @ 110°C<br>Flood exposure: 210 mJ/cm<sup>2</sup><br>Development: 70 s submersion
|-
! scope=row| AZ 4562
| Long ago || ? || 10 µm || ? || 320 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Priming: HMDS<BR>Rehydration after SB: none<br>Exposure: Multiple exposures with 15 s pauses is recommended<br>Degassing after exposure: none<br>Development: 300 s submersion
|}
 
'''New resists version in 2023'''<br>
As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. This table contains only information about the <i>old</i> resist versions.
 
<br clear="all" />
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