Specific Process Knowledge/Lithography

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Comparing lithography methods at DTU Danchip

	UV Lithography	DUV Stepper Lithography	E-beam Lithography	Nano Imprint Lithography	2-Photon Polymerization Lithography
Generel description	Pattern transfer via UltraViolet (UV) light	Pattern transfer via DeepUltraViolet (DUV) light	Patterning by electron beam	Pattern transfer via hot embossing(HE)	Direct writing via IR laser
Pattern size range	~1.25 µm and up	~200 nm and up	~12 nm - 1 µm	~20 nm and up	3D voxel through transparent substrate: 0.3 µm diameter; 0.6 µm high 2D spot on opaque substrate: 0.6 µm diameter
Resist type	UV sensitive: AZ 5214E, AZ 4562, AZ MiR 701 (positive) AZ 5214E, AZ nLOF 2020, SU-8 (negative)	DUV sensitive JSR KRF M230Y, JSR KRF M35G (positive) UVN2300-0.8 (negative)	E-beam sensitive AR-P6200 CSAR, ZEP502A , PMMA, HSQ, mr-EBL, AR-N 7520	Imprint polymers: Topas PMMA	UV sensitive: IP photoresists, SU-8 (3D) AZ resists (2D)
Resist thickness range	~0.5µm to 20µm	~50nm to 2µm	~30nm to 0.5 µm	~ 100nm to 2µm	droplet or coating
Typical exposure time	2s-30s pr. wafer	Process depended, depends on pattern, pattern area and dose	Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]: t = Q*A/I	Process depended, depends also on heating and cooling temperature rates	Process depended, depends on pattern and dose
Substrate size	small samples 50 mm wafers 100 mm wafers 150 mm wafers	100 mm wafers 150 mm wafers 200 mm wafers	We have cassettes that fit to 4 small samples (20mm, 12mm, 8mm, 4mm) 6 wafers of 50 mm in size 2 wafers of 100 mm in size 1 wafer of 150 mm in size Only one cassette can be loaded at time	small samples 50 mm wafers 100 mm wafers 150 mm wafers	Cover slides 50 mm wafers 100 mm wafers IBIDI
Allowed materials	Any standard cleanroom material	Any standard cleanroom material	Any standard cleanroom material	Any standard cleanroom material	Any standard cleanroom material

Equipment Pages

Pretreatment HMDS BHF Oven 250C Coaters SSE Spinner Spin Track 1 + 2 Spin Coater: RCD8 SÜSS Spinner-Stepper Manual Spinner (Polymers) Manual Spinner 1 (Laurell) Spin coater: Manual Labspin Spray Coater UV Exposure KS Aligner Aligner-6inch III-V Aligner Inclined UV lamp	Electron Beam Exposure JEOL JBX-9500FSZ Deep-UV Exposure DUV Stepper FPA-3000EX4 from Canon Baking Hotplates Ovens Development Developer-1 and Developer-2 Developer-6inch SU8-Developer Developer-TMAH Developer TMAH UV-lithography	Strip Plasma Asher 1 Plasma Asher 2 III-V Plasma Asher Rough Acetone Strip Fine Acetone Strip Lift-off Lift-off Wet Bench Lift-off (4", 6") NanoImprint Lithography Molecular Vapour Deposition EVG NIL 3D Lithography 2-Photon Polymerization

Knowledge and Information about Lithography

THIS SECTION IS UNDER CONSTRUCTION

Literature Franssila, 2010, Chapter 9: Optical Lithography Franssila, 2010, Chapter 10: Advanced Lithography Application Notes from MicroChemicals Lithography Troubleshooter from MicroChemicals Handbook of Microlithography, Micromachining, and Microfabrication, Chapter 2: E-beam Lithography Stefan Landis,Lithography, Chapter 3: E-beam Lithography Training Lithography Tool Package Training E-beam training Spin Coating Slides on spin coating Training Video: Automatic Spin Coater Training Video: Manual Spin Coater	UV Exposure Slides on UV exposure Training Video: UV Mask Aligner Part I (Operation) Training Video: UV Mask Aligner Part II (Alignment) Information on UV Exposure Dose Electron Beam Exposure Training on JEOL JBX-9500FSZ E-beam resists and process flows Lecture on E-beam Lithography Deep-UV Exposure Deep-UV Stepper Lithography	Development Slides on development Training Video: Automatic Puddle Developer Training Video: Manual Puddle Developer Post-Processing Slides on post-processing UV Resists Slides on photoresist UV Resist Overview Inspection of Resist Patterns Slides on inspection Slides on process effects and examples