Specific Process Knowledge/Lithography

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Comparing lithography methods at DTU Danchip

	UV Lithography	DUV Stepper Lithography	E-beam Lithography	Nano Imprint Lithography	2-Photon Polymerization Lithography
Generel description	Pattern transfer via UltraViolet (UV) light	Pattern transfer via DeepUltraViolet (DUV) light	Patterning by electron beam	Pattern transfer via hot embossing(HE)	Direct writing via IR laser
Pattern size range	~1.25 µm and up	~200 nm and up	~12 nm - 1 µm	~20 nm and up	3D voxel through transparent substrate: 0.3 µm diameter; 0.6 µm high 2D spot on opaque substrate: 0.6 µm diameter
Resist type	UV sensitive: AZ 5214E, AZ 4562, AZ MiR 701 (positive) AZ 5214E, AZ nLOF 2020, SU-8 (negative)	DUV sensitive JSR KRF M230Y, JSR KRF M35G (positive) UVN2300-0.8 (negative)	E-beam sensitive AR-P6200 CSAR, ZEP502A , PMMA, HSQ, mr-EBL, AR-N 7520	Imprint polymers: Topas PMMA	UV sensitive: IP photoresists, SU-8 (3D) AZ resists (2D)
Resist thickness range	~0.5µm to 20µm	~50nm to 2µm	~30nm to 0.5 µm	~ 100nm to 2µm	droplet or coating
Typical exposure time	2s-30s pr. wafer	Process depended, depends on pattern, pattern area and dose	Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]: t = Q*A/I	Process depended, depends also on heating and cooling temperature rates	Process depended, depends on pattern and dose
Substrate size	small samples 50 mm wafers 100 mm wafers 150 mm wafers	100 mm wafers 150 mm wafers 200 mm wafers	We have cassettes that fit to 4 small samples (20mm, 12mm, 8mm, 4mm) 6 wafers of 50 mm in size 3 wafers of 100 mm in size 1 wafer of 150 mm in size Only one cassette can be loaded at time	small samples 50 mm wafers 100 mm wafers 150 mm wafers	Cover slides 50 mm wafers 100 mm wafers IBIDI
Allowed materials	Any standard cleanroom material	Any standard cleanroom material	Any standard cleanroom material	Any standard cleanroom material	Any standard cleanroom material

Equipment Pages

Pretreatment HMDS BHF Oven 250C Coaters Spin Coater: Gamma UV SSE Spinner Spin Track 1 + 2 Spin Coater: RCD8 SÜSS Spinner-Stepper Manual Spinner (Polymers) Manual Spinner 1 (Laurell) Spin coater: Manual Labspin Spray Coater Baking Hotplates Ovens	UV Exposure KS Aligner Aligner: MA6-2 Aligner-6inch III-V Aligner Inclined UV lamp Electron Beam Exposure JEOL JBX-9500FSZ Deep-UV Exposure DUV Stepper FPA-3000EX4 from Canon Development Developer-1 and Developer-2 Developer-6inch SU8-Developer Developer: TMAH Manual Developer: TMAH UV-lithography	Strip Plasma Asher 1 Plasma Asher 2 III-V Plasma Asher Rough Acetone Strip Fine Acetone Strip Lift-off Lift-off Wet Bench Lift-off (4", 6") NanoImprint Lithography Molecular Vapour Deposition EVG NIL 3D Lithography 2-Photon Polymerization

Lithography Tool Package Training

DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipments, as well as training in equipment operation and processing in the cleanroom.

The course is for all users that intend to perform any kind of lithographic processing in the cleanroom.

Tool Package Training Lithography
Schedule	Lecture once a month (~3.5 hours) NEXT LECTURE: Tuesday 10th of May 9:15 - 13:00 (B347 Seminar Room) Training session once a week, max. 4 persons per session (9:00 - 16:00) NEXT SESSIONS: 20th of April, 29th of April, 3rd of May
Location	Meeting room bulding 347 at DTU Danchip and in cleanroom facilities at DTU Danchip
Qualified Prerequisites	Cleanroom safety course at DTU Danchip Wet Chemistry Course at DTU Danchip
Preparations	Before the lecture Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus, see link below) Optional but recommended: Watch the training videos (training videos can be found below). Before training session Watch the training videos of spin coating (automatic), exposure (operation and alignment), and development (automatic). The training videos can be found below. Study the equipment manuals. The manuals are available in LabManager. Study the TPT process flows (first print and alignment). The process flows can be found below.
Course Responsible	The Lithography Group at DTU Danchip: sign up for the course by e-mailing to lithography@danchip.dtu.dk.
Learning Objectives	Describe fundamental parts of lithographic processing in a cleanroom, design of process flows Authorization to use spin coater, mask aligner, and developer at DTU Danchip Calculate relevant process parameters Analyze and apply your results of lithographic processing

Knowledge and Information about Lithography

Literature Franssila, 2010, Chapter 9: Optical Lithography Franssila, 2010, Chapter 10: Advanced Lithography Lithography Troubleshooter from MicroChemicals Application Notes from MicroChemicals Handbook of Microlithography, Micromachining, and Microfabrication, Chapter 2: E-beam Lithography Stefan Landis,Lithography, Chapter 3: E-beam Lithography Training videos Training Video: Automatic Spin Coater Training Video: Manual Spin Coater Training Video: UV Mask Aligner Part I (Operation) Training Video: UV Mask Aligner Part II (Alignment) Training Video: Automatic Puddle Developer Training Video: Manual Puddle Developer	Manuals Automatic Spin Coater: Manual Spin Coater: UV Mask Aligner: Automatic Puddle Developer: Manual Puddle Developer: Process Flows TPT first print process flow TPT alignment process flow Slides from Lecture TPT slides: Introduction TPT slides: Spin Coating TPT slides: UV Exposure TPT slides: Development TPT slides: Post-processing TPT slides: Process Effects and Examples	Resists UV Resist Overview E-beam Resist Overview UV Exposure Information on UV Exposure Dose Electron Beam Exposure Training on JEOL JBX-9500FSZ E-beam resists and process flows Lecture on E-beam Lithography Deep-UV Exposure Deep-UV Stepper Lithography