Specific Process Knowledge/Lithography/UVLithography

From LabAdviser

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UV Lithography uses ultraviolet light to transfer a pattern from a mask to a wafer coated with photoresist. The photoresist film is spin coated on the wafers and the pattern is transferred to the wafer by using a mask aligner. DTU Danchip houses a number of automatic or semi-automatic coaters and mask aligners.



Resist Overview

Resist Polarity Manufacturer Comments Technical reports Spin Coating Exposure dose Developer Rinse Remover Process flows (in docx-format)
AZ 5214E Positive but can be reversed AZ Electronic Materials Can be used for both positive and reverse processes with resist thickness between 1 to 4um. AZ5214E.pdf‎ SSE, KS Spinner, III-V Spinner ... AZ 351B developer DI water Acetone
AZ 4562 Positive AZ Electronic Materials For process with resist thickness between 6 and 25um. AZ4500.pdf‎ SSE, KS Spinner ... AZ 351B developer DI water Acetone Process_Flow_thick_AZ4562.docx‎
AZ MiR 701 Positive AZ Electronic Materials High selectivity for dry etch. AZ_MiR_701.pdf‎ Spin Track 1 + 2 Preliminary results:

105 mJ/cm2 per µm resist for i-line

1/5 dose for broadband exposure

AZ 726 MIF developer DI water Remover 1165 Process_Flow_AZ_MiR701.docx‎
AZ nLOF 2020 Negative AZ Electronic Materials AZ_nLOF_2020.pdf‎ Spin Track 1 + 2 ... AZ 726 MIF developer DI water Remover 1165 Process_Flow_AZ_nLOF_2020.docx‎


SU-8 Negative Microchem SU-8_DataSheet_2005.pdf‎, SU-8_DataSheet_2075.pdf‎ KS Spinner Thickness and process dependent PGMEA, mr-Dev 600 developer IPA Plasma ashing can remove crosslinked SU8. Process_Flow_SU8_70um.docx‎




UV Lithography Equipment


Pretreatment

Coaters

UV Exposure

Baking

Development

Strip

Lift-off

Wafer Cleaning