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Specific Process Knowledge/Lithography/EBeamLithography/EBLLandingpage: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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Thope (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
2,178 edits
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[[File:EBLWorkflow.png|1200px|frameless|center|alt=Generalized EBL workflow.|Generalized EBL workflow.]]
[[File:EBLWorkflow.png|1200px|frameless|center|alt=Generalized EBL workflow.|Generalized EBL workflow.]]
While substrate preparation and development processes are (nearly) identical for the JEOL and Raith eLine systems, pattern preparation, job preparation and job execution are fairly different and all details are found under the respective tool pages.


= E-beam resists =
= E-beam resists =
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