Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
No edit summary |
|||
| Line 1: | Line 1: | ||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/UVLithography click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/UVLithography click here]''' | ||
[[Image:UVLithography.jpg|320x320px|right | [[Image:UVLithography.jpg|320x320px|right|]] | ||
UV Lithography uses ultraviolet light to transfer a pattern from a photo-mask or a design file to a wafer coated with photoresist. The photoresist film is spin coated onto the wafers, the design is transferred to the resist by using an aligner, and subsequently the resist pattern is developed. DTU Nanolab houses a number of automatic or manual coaters, mask or maskless aligners, as well as automatic or semi-automatic developers. | UV Lithography uses ultraviolet light to transfer a pattern from a photo-mask or a design file to a wafer coated with photoresist. The photoresist film is spin coated onto the wafers, the design is transferred to the resist by using an aligner, and subsequently the resist pattern is developed. DTU Nanolab houses a number of automatic or manual coaters, mask or maskless aligners, as well as automatic or semi-automatic developers. | ||