Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
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* '''Substrate pretreatment''': In many processes it is recommended to <u>[[Specific_Process_Knowledge/Lithography/Pretreatment|pretreat or prime]]</u> your wafer before spin-coating. In some <u>[[Specific_Process_Knowledge/Lithography/Coaters|spin-coaters]]</u>, these pretreatment processes are included in the spin coating of resist. | * '''Substrate pretreatment''': In many processes it is recommended to <u>[[Specific_Process_Knowledge/Lithography/Pretreatment|pretreat or prime]]</u> your wafer before spin-coating. In some <u>[[Specific_Process_Knowledge/Lithography/Coaters|spin-coaters]]</u>, these pretreatment processes are included in the spin coating of resist. | ||
* '''Resist Type''': Choose the type of resist you wish to use: a list of UV lithography resist types available at DTU Nanolab can be found <u>[[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|on this page]]</u>. | * '''Resist Type''': Choose the type of resist you wish to use: a list of UV lithography resist types available at DTU Nanolab can be found <u>[[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|on this page]]</u>. | ||
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** For <u>[[Specific_Process_Knowledge/Lithography/LiftOff|lift-off]]</u> processes, we recommend resist thickness at least 5 times larger than the thickness of the metal to be lifted. | ** For <u>[[Specific_Process_Knowledge/Lithography/LiftOff|lift-off]]</u> processes, we recommend resist thickness at least 5 times larger than the thickness of the metal to be lifted. | ||
** For dry etch or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist. | ** For dry etch or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist. | ||
* '''Spin Coater''': Do you wish to use a manual spin coater or a robot spin coater? See a list of spin coaters <u>[[Specific_Process_Knowledge/Lithography/Coaters|here]]</u>. | |||
*'''Exposure''': Choose which aligner you wish to use, and consider the exposure dose. | *'''Exposure''': Choose which aligner you wish to use, and consider the exposure dose. | ||
** You can find a list of mask aligners <u>[[Specific_Process_Knowledge/Lithography/UVExposure|here]]</u>. | ** You can find a list of mask aligners and maskless aligners <u>[[Specific_Process_Knowledge/Lithography/UVExposure|here]]</u>. | ||
** You can find information on dose <u>[[Specific_Process_Knowledge/Lithography/UVExposure_Dose|here]]</u>. | ** You can find information on dose <u>[[Specific_Process_Knowledge/Lithography/UVExposure_Dose|here]]</u>. | ||
* '''Mask''': Design and order a photomask for your UV process. A detailed instruction on how to design and order a photomask can be found <u>[[Specific_Process_Knowledge/Pattern_Design|here]]</u>. | * '''Mask''': Design your device and layout, and order a photomask for your UV process. A detailed instruction on how to design a layout, and how to order a photomask can be found <u>[[Specific_Process_Knowledge/Pattern_Design|here]]</u>. | ||
* '''Development''': Choose which equipment you wish to use to develop your photoresist from <u>[[Specific_Process_Knowledge/Lithography/Development|this list]]</u>. Remember the development process influences the <u>[[Specific_Process_Knowledge/Lithography/UVExposure_Dose|exposure dose]]</u>. | * '''Development''': Choose which equipment you wish to use to develop your photoresist from <u>[[Specific_Process_Knowledge/Lithography/Development|this list]]</u>. Remember the development process influences the <u>[[Specific_Process_Knowledge/Lithography/UVExposure_Dose|exposure dose]]</u>. | ||