Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
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Resist thickness 1.5 - 4 µm. | Resist thickness 1.5 - 4 µm. | ||
|[[media:AZ_nLOF_2020.pdf|AZ_nLOF_2020.pdf]] | |[[media:AZ_nLOF_2020.pdf|AZ_nLOF_2020.pdf]] | ||
[https://www.microchemicals.com/micro/tds_az_nlof2000_series.pdf Photoresist AZ®nLOF 2020 (TDS)] | |||
|[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]; | |[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]; | ||