Specific Process Knowledge/Lithography

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Comparing lithography methods at DTU Danchip

	UV Lithography	DUV Stepper Lithography	E-beam Lithography	Nano Imprint Lithography
Generel description	Pattern transfer via UltraViolet (UV) light	Pattern transfer via DeepUltraViolet (DUV) light	Patterning by electron beam	Pattern transfer via hot embossing (HE)
Pattern size range	Resist type, thickness, and pattern dependent ~1.25 µm and up	pattern type, shape and pitch dependent ~200 nm and up	~12 nm - 1 µm	~20 nm and up
Resist type	UV sensitive: AZ 5214E, AZ 4562, AZ MiR 701 (positive) AZ 5214E, AZ nLOF 2020, SU-8 (negative)	DUV sensitive JSR KRF M230Y, JSR KRF M35G (positive) UVN2300-0.8 (negative)	E-beam sensitive AR-P6200 CSAR, ZEP502A , PMMA, HSQ, mr-EBL, AR-N 7520	Imprint polymers: Topas PMMA
Resist thickness range	~0.5µm to 20µm	~50nm to 2µm	~30nm to 0.5 µm	~ 100nm to 2µm
Typical exposure time	2s-30s pr. wafer	Process depended, depends on pattern, pattern area and dose	Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]: t = Q*A/I	Process depended, depends also on heating and cooling temperature rates
Substrate size	small samples 50 mm wafers 100 mm wafers 150 mm wafers	100 mm wafers 150 mm wafers 200 mm wafers	We have cassettes that fit to 4 small samples (20mm, 12mm, 8mm, 4mm) 6 wafers of 50 mm in size 3 wafers of 100 mm in size 1 wafer of 150 mm in size Only one cassette can be loaded at time	small samples 50 mm wafers 100 mm wafers 150 mm wafers
Allowed materials	Any standard cleanroom material	Any standard cleanroom material	Any standard cleanroom material	Any standard cleanroom material

Equipment Pages

Pretreatment HMDS BHF Oven 250C Coating Spin Coater: Gamma UV Spin Track 1 + 2 Spin Coater: RCD8 Spin Coater: Manual ... Spray Coater Spin coater: Süss Stepper Baking Hotplates Ovens	UV Exposure KS Aligner Aligner: MA6-2 Aligner: 6inch Inclined UV-lamp Aligner: Maskless 01 Deep-UV Exposure DUV Stepper (Canon FPA-3000EX4) Electron Beam Exposure E-Beam Writer 9500 (JEOL JBX-9500FSZ) Raith Elphy on SEM - LEO Development Developer: 6inch Developer: SU8 Developer: TMAH Manual Developer: TMAH UV-lithography Developer: TMAH Stepper	Strip Plasma Asher 1 Plasma Asher 2 III-V Plasma Asher Resist Strip Lift-off Lift-off NanoImprint Lithography Molecular Vapour Deposition Imprinter 01

Lithography Tool Package Training

DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment, as well as training in equipment operation and processing in the cleanroom.

The course is for all users that intend to perform any kind of lithographic processing in the cleanroom, and is a prerequisite for training in other lithography equipment.

For details, dates, and course material, please check the course description under Courses.

Lithography Tool Package Training
Schedule	Theoretical part A 1 hour "questions and exercises" session once or twice a month will be planned as needed (typically Fridays 09:30-10:30). Practical part A 4-5 hour training session 2-3 times a month, max. 4 persons per session (typically Wednesdays 09:00 - 14:00).
Location	Theoretical part The location of the "questions and exercises" session will be specified after signing up for the course. Practical part The training session takes place inside the cleanroom. The meeting point will be in front of the first equipment.
Qualified Prerequisites	Cleanroom safety course at DTU Danchip Admission to the cleanroom must be obtained before the training session
Preparations	Before the "questions and exercises" session Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus) Watch the lecture videos (7 videos, 2:41 hours in total). Write down any questions that may arise during the videos. Before training session Watch the training videos of spin coating (automatic), exposure (operation, and alignment), and development (automatic). Study the equipment manuals. The manuals are available in LabManager. Study the TPT process flows (first print, and alignment).
Course Responsible	The Lithography Group at DTU Danchip. Sign up for the course by e-mailing to lithography@danchip.dtu.dk.
Learning Objectives	Describe fundamental parts of lithographic processing in a cleanroom, design of process flows Authorization to use spin coater, mask aligner, and developer at DTU Danchip Calculate relevant process parameters Analyze and apply your results of lithographic processing

Knowledge and Information about Lithography

Literature Franssila, 2010, Chapter 9: Optical Lithography Franssila, 2010, Chapter 10: Advanced Lithography Lithography Troubleshooter from MicroChemicals Application Notes from MicroChemicals Handbook of Microlithography, Micromachining, and Microfabrication, Chapter 2: E-beam Lithography Stefan Landis,Lithography, Chapter 3: E-beam Lithography Lecture videos Lecture videos (7 videos, 2:41 hours in total) Slides from Lecture TPT slides: Introduction TPT slides: Spin Coating TPT slides: UV Exposure TPT slides: Development TPT slides: Post-processing TPT slides: Process Effects and Examples	Training videos Training Video: Automatic Spin Coater Training Video: Manual Spin Coater Training Video: UV Mask Aligner Part I (Operation) Training Video: UV Mask Aligner Part II (Alignment) Training Video: Automatic Puddle Developer Training Video: Manual Puddle Developer Manuals Automatic Spin Coater: Spin Coater: Gamma UV Manual Spin Coater: Spin Coater: Manual Standard Resists UV Mask Aligner: Aligner: MA6 - 2 or KS Aligner Automatic Puddle Developer: Developer: TMAH UV-lithography Manual Puddle Developer: Developer: TMAH Manual Process Flows TPT first print process flow TPT alignment process flow	Resists UV Resist Overview E-beam Resist Overview UV Exposure Information on UV Exposure Dose Electron Beam Exposure Training on JEOL JBX-9500FSZ E-beam resists and process flows Lecture on E-beam Lithography Deep-UV Exposure Deep-UV Stepper Lithography