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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
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<!--'''<span style="color: red;">OBS: The December Litho TPT has been cancelled due to sickness. Contact the Lithography Group for rescheduling if this poses a problem.</span>''' <span style="text-decoration: line-through;">'''NEXT LECTURE: Tuesday 29th of November 9:15 - 13:00 (B347, Seminar room)'''</span>-->
<!--'''<span style="color: red;">OBS: The December Litho TPT has been cancelled due to sickness. Contact the Lithography Group for rescheduling if this poses a problem.</span>''' <span style="text-decoration: line-through;">'''NEXT LECTURE: Tuesday 29th of November 9:15 - 13:00 (B347, Seminar room)'''</span>-->
*Lecture once a month (~3.5 hours). '''NEXT LECTURE: <span style="color: red;">Starting February 2017 (Week 06), the lecture will be replaced by videos and a short "questions and exercises" session. More info will come later this month.</span>'''
'''Theoretical part'''
*Training session once a week, max. 4 persons per session (9:00 - 14:00). '''NEXT SESSIONS: 8th of February, 15th of February, 22nd of February'''
* The lecture has been replaced by videos that can be viewed at one's own leisure.
* A 1 hour "questions and exercises" session will be planned as needed.  
* '''NEXT "questions and exercises" session: Friday 3rd of February 09:30-10:30'''
'''Practical part'''
* A training session once a week, max. 4 persons per session (9:00 - 14:00).  
* '''NEXT training sessions: 8th of February, 15th of February, 22nd of February'''
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!Location
!Location
|Seminar room bulding 347 at DTU Danchip and in cleanroom facilities at DTU Danchip
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'''Theoretical part'''
* The location of the "questions and exercises" session will be specified after signing up to the course.
'''Practical part'''
* The training session takes place inside the cleanroom. The meeting point will be in front of the first machine.
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* Cleanroom safety course at DTU Danchip  
* Cleanroom safety course at DTU Danchip  
* Wet Chemistry Course at DTU Danchip (Lab-Intro)
* Admission to the cleanroom must be obtained before the training session
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!Preparations
!Preparations
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'''Before the lecture'''
'''Before the "questions and exercises" session'''
* Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus, see link below)
* Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus, see link below)
* Optional but recommended: Watch the training videos (training videos can be found below).
* Watch the lecture videos (7 videos, 2:41 hours in total). A link to the lecture videos can be found below.
'''Before training session'''
'''Before training session'''
* Watch the training videos of spin coating (automatic), exposure (operation and alignment), and development (automatic). The training videos can be found below.
* Watch the training videos of spin coating (automatic), exposure (operation and alignment), and development (automatic). The training videos can be found below.

Revision as of 15:11, 27 January 2017


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Comparing lithography methods at DTU Danchip

UV Lithography DUV Stepper Lithography E-beam Lithography Nano Imprint Lithography
Generel description Pattern transfer via UltraViolet (UV) light Pattern transfer via DeepUltraViolet (DUV) light Patterning by electron beam Pattern transfer via hot embossing (HE)
Pattern size range
  • Resist type, thickness, and pattern dependent
  • ~1.25 µm and up
  • pattern type, shape and pitch dependent
  • ~200 nm and up
  • ~12 nm - 1 µm
  • ~20 nm and up
Resist type
  • UV sensitive:
    • AZ 5214E, AZ 4562, AZ MiR 701 (positive)
    • AZ 5214E, AZ nLOF 2020, SU-8 (negative)
  • DUV sensitive
    • JSR KRF M230Y, JSR KRF M35G (positive)
    • UVN2300-0.8 (negative)
  • E-beam sensitive
    • AR-P6200 CSAR, ZEP502A , PMMA, HSQ, mr-EBL, AR-N 7520
  • Imprint polymers:
    • Topas
    • PMMA
Resist thickness range

~0.5µm to 20µm

~50nm to 2µm

~30nm to 0.5 µm

~ 100nm to 2µm

Typical exposure time

2s-30s pr. wafer

Process depended, depends on pattern, pattern area and dose

Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]: t = Q*A/I

Process depended, depends also on heating and cooling temperature rates

Substrate size
  • small samples
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers

We have cassettes that fit to

  • 4 small samples (20mm, 12mm, 8mm, 4mm)
  • 6 wafers of 50 mm in size
  • 3 wafers of 100 mm in size
  • 1 wafer of 150 mm in size

Only one cassette can be loaded at time

  • small samples
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials
  • Any standard cleanroom material
  • Any standard cleanroom material
  • Any standard cleanroom material
  • Any standard cleanroom material


Equipment Pages

Pretreatment

Coaters

Baking

UV Exposure

Deep-UV Exposure

Electron Beam Exposure

Development

Strip

Lift-off

NanoImprint Lithography


Lithography Tool Package Training

DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipments, as well as training in equipment operation and processing in the cleanroom.

The course is for all users that intend to perform any kind of lithographic processing in the cleanroom.


Lithography Tool Package Training
Schedule

Theoretical part

  • The lecture has been replaced by videos that can be viewed at one's own leisure.
  • A 1 hour "questions and exercises" session will be planned as needed.
  • NEXT "questions and exercises" session: Friday 3rd of February 09:30-10:30

Practical part

  • A training session once a week, max. 4 persons per session (9:00 - 14:00).
  • NEXT training sessions: 8th of February, 15th of February, 22nd of February
Location

Theoretical part

  • The location of the "questions and exercises" session will be specified after signing up to the course.

Practical part

  • The training session takes place inside the cleanroom. The meeting point will be in front of the first machine.
Qualified Prerequisites
  • Cleanroom safety course at DTU Danchip
  • Admission to the cleanroom must be obtained before the training session
Preparations

Before the "questions and exercises" session

  • Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus, see link below)
  • Watch the lecture videos (7 videos, 2:41 hours in total). A link to the lecture videos can be found below.

Before training session

  • Watch the training videos of spin coating (automatic), exposure (operation and alignment), and development (automatic). The training videos can be found below.
  • Study the equipment manuals. The manuals are available in LabManager.
  • Study the TPT process flows (first print and alignment). The process flows can be found below.
Course Responsible

The Lithography Group at DTU Danchip: sign up for the course by e-mailing to lithography@danchip.dtu.dk.

Learning Objectives
  • Describe fundamental parts of lithographic processing in a cleanroom, design of process flows
  • Authorization to use spin coater, mask aligner, and developer at DTU Danchip
  • Calculate relevant process parameters
  • Analyze and apply your results of lithographic processing



Knowledge and Information about Lithography

Literature


Lecture videos


Slides from Lecture

Training videos


Manuals


Process Flows

Resists


UV Exposure


Electron Beam Exposure


Deep-UV Exposure


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