Specific Process Knowledge/Lithography: Difference between revisions
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|Pattern transfer via DeepUltraViolet (DUV) light | |Pattern transfer via DeepUltraViolet (DUV) light | ||
|Patterning by electron beam | |Patterning by electron beam | ||
|Pattern transfer via hot embossing(HE) | |Pattern transfer via hot embossing (HE) | ||
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!Pattern size range | !Pattern size range | ||
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*Resist type, thickness, and pattern dependent | |||
*~1.25 µm and up | *~1.25 µm and up | ||
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