Jump to content

Specific Process Knowledge/Lithography/UVLithography: Difference between revisions

Tigre (talk | contribs)
Tigre (talk | contribs)
Line 23: Line 23:
* '''Spin Coater''': Do you wish to use a manual spin coater or a robot spin coater? A manual spin coater is recommended for batches < 5 wafers. See a list of spin coaters [[Specific_Process_Knowledge/Lithography/Coaters|here]].
* '''Spin Coater''': Do you wish to use a manual spin coater or a robot spin coater? A manual spin coater is recommended for batches < 5 wafers. See a list of spin coaters [[Specific_Process_Knowledge/Lithography/Coaters|here]].


* '''Resist Type''': Choose the type of resist you wish to use:
* '''Resist Type''': Choose the type of resist you wish to use: a list of UV lithography resist types available at DTU Danchip can be found [[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|on this page]].
** Positive tone resist: Resist exposed to UV light will be dissolved in the developer. The mask is an exact copy of the pattern which is to remain on the wafer.
** Positive tone resist: Resist exposed to UV light will be dissolved in the developer. The mask is an exact copy of the pattern which is to remain on the wafer.
** Negative tone resist: Resist exposed to UV light will become polymerized and difficult to dissolve. The mask is an inverse copy of the pattern which is to remain on the wafer.
** Negative tone resist: Resist exposed to UV light will become polymerized and difficult to dissolve. The mask is an inverse copy of the pattern which is to remain on the wafer.
::A list of UV lithography resist types available at DTU Danchip can be found [[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|on this page]].


* '''Thickness of resist''': In general, it is recommended to work at or below an aspect ratio of ~1, i.e. where the width of the pattern is not smaller than the thickness of the resist. Furthermore, when you decide for the resist thickness, consider which transfer you need:
* '''Thickness of resist''': In general, it is recommended to work at or below an aspect ratio of ~1, i.e. where the width of the pattern is not smaller than the thickness of the resist. Furthermore, when you decide for the resist thickness, consider which transfer you need: