Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
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|For process with resist thickness between 6 and 25um. | |For process with resist thickness between 6 and 25um. | ||
|[[media:AZ4500.pdf|AZ4500.pdf]] | |[[media:AZ4500.pdf|AZ4500.pdf]] | ||
|[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE]] | |[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE]] or | ||
[[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]] | |||
|28 mJ/cm<sup>2</sup> per µm resist for i-line, probably increasing with increasing thickness. | |28 mJ/cm<sup>2</sup> per µm resist for i-line, probably increasing with increasing thickness. | ||