Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)'' | *[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)'' | ||
*[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel'' | *[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel'' | ||
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==[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]== | |||
===[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]=== | |||
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]] | |||
*[[Specific Process Knowledge/Lithography/Pretreatment#BHF|BHF]] | |||
*[[Specific Process Knowledge/Lithography/Pretreatment#250_C_oven_for_pretreatment|250C Oven for Pretreatment]] | |||
===[[Specific Process Knowledge/Lithography/Coaters|Coaters]]=== | |||
*[[Specific Process Knowledge/Lithography/Coaters#SSE Spinner|SSE Spinner]] | |||
*[[Specific Process Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]] | |||
*[[Specific Process Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]] | |||
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner (Polymers)|Manual Spinner (Polymers)]] | |||
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner 1 (Laurell)|Manual Spinner 1 (Laurell)]] | |||
*[[Specific Process Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]] | |||
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]] | |||
===[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]=== | |||
*[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]] | |||
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner-6inch|Aligner-6inch]] | |||
*[[Specific Process Knowledge/Lithography/UVExposure#III-V Aligner|III-V Aligner]] | |||
*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV lamp]] | |||
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===[[Specific Process Knowledge/Lithography/Baking|Baking]]=== | |||
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]] | |||
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]] | |||
===[[Specific Process Knowledge/Lithography/Development|Development]]=== | |||
*[[Specific Process Knowledge/Lithography/Development#Automatic Developer Bench for 4" and 6"|Developer Bench]] | |||
===[[Specific Process Knowledge/Lithography/Strip|Strip]]=== | |||
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 1|Plasma Asher 1]] | |||
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 2|Plasma Asher 2]] | |||
*[[Specific Process Knowledge/Lithography/Strip#III-V Plasma Asher|III-V Plasma Asher]] | |||
*[[Specific Process Knowledge/Lithography/Strip#Rough Acetone Strip|Rough Acetone Strip]] | |||
*[[Specific Process Knowledge/Lithography/Strip#Fine Acetone Strip|Fine Acetone Strip]] | |||
===[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]=== | |||
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOffWetBench|Lift-off Wet Bench]] | |||
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOff(4",6")|Lift-off (4", 6")]] | |||
===[[Specific Process Knowledge/Lithography/WaferCleaning|Wafer Cleaning]]=== | |||
*[[Specific Process Knowledge/Lithography/WaferCleaning#Spindryers|Spin dryers]] | |||
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==[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]== | |||
*[[Specific Process Knowledge/Lithography/DUVStepper#SÜSS Spinner-Stepper|SÜSS Spinner-Stepper]] | |||
*[[Specific Process Knowledge/Lithography/DUVStepper#Process information|Process information]] | |||
*[[Specific Process Knowledge/Lithography/DUVStepper#DUV Stepper FPA-3000EX4 from Canon|DUV Stepper FPA-3000EX4 from Canon]] | |||
*[[Specific Process Knowledge/Lithography/DUVStepper#Process information|Process information]] | |||
*[[Specific Process Knowledge/Lithography/DUVStepper#Overview of performance|Overview of performance]] | |||
==[[Specific Process Knowledge/Lithography/EBeamLithography|E-Beam Lithography]]== | |||
*[[Specific Process Knowledge/Lithography/EBeamLithography#Performance of the e-beam writer|Performance]] | |||
*[[Specific Process Knowledge/Lithography/EBeamLithography#Getting started|Getting started]] | |||
*[[Specific Process Knowledge/Lithography/EBeamLithography#E-beam resists and Process Flows|E-beam resists and Process Flows]] | |||
*[[Specific Process Knowledge/Lithography/EBeamLithography#Proximity Error Correction|Proximity Error Correction]] | |||
*[[Specific Process Knowledge/Lithography/EBeamLithography#Charging of non-conductive substrates|Charging of non-conductive substrates]] | |||
==[[Specific Process Knowledge/Lithography/NanoImprintLithography|NanoImprint Lithography]]== | |||
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#Molecular Vapour Deposition|Molecular Vapour Deposition]] | |||
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#ObducatNIL|Obducat NIL]] | |||
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|EVG NIL]] | |||
==[[Specific Process Knowledge/Lithography/3DLithography|3D Lithography]]== | |||
*[[Specific Process Knowledge/Lithography/3DLithography#2-Photon Polymerization|2-Photon Polymerization]] | |||
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Revision as of 12:13, 14 October 2013
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Choose material to deposit
Dielectrica
- Silicon Nitride - Silicon nitride and silicon oxynitride
- Silicon Oxide
- Titanium Oxide
Metals/elements
Period/Group |
IVB | VB | VIB | VIIIB | IB | IIIA | IVA |
3 | . | . | . | . | . | 13 Al Aluminium | 14 Si Silicon |
4 | 22 Ti Titanium | . | 24 Cr Chromium | 28 Ni Nickel | 29 Cu Copper | . | 32 Ge Germanium |
5 | . | . | 42 Mo Molybdenum | 46 Pd Palladium | 47 Ag Silver | . | 50 Sn Tin |
6 | . | 73 Ta Tantalum | 74 W Tungsten | 78 Pt Platinum | 79 Au Gold | . | . |
Alloys
Polymers
- SU8
- Antistiction coating
- Topas
- PMMA
Choose deposition equipment
- Alcatel - E-beam evaporator and sputter tool
- Lesker - Sputter tool
- PVD co-sputter/evaporation - E-beam evaporator and multiple wafer tool
- Wordentec - E-beam evaporator, sputter and thermal evaporator
- Physimeca - E-beam evaporator (III-V lab)
- IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching
- Hummer - Gold sputtering system
- PECVD - Plasma Enhanced Chemical Vapor deposition
- Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride
- Furnace LPCVD Polysilicon (4" and 6") - Deposition of polysilicon
- Furnace LPCVD TEOS (4") - Deposition of silicon oxide
- MVD - Molecular Vapor Deposition
- Black Magic PECVD - Black Magic PECVD (Carbon)
- Electroplating-Ni - Electrochemical deposition of nickel