Specific Process Knowledge/Thin film deposition: Difference between revisions

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*[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)''
*[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)''
*[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel''
*[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel''
= !!!=
{| style="color: black;" width="100%"
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==[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]==
===[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]===
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#BHF|BHF]]
*[[Specific Process Knowledge/Lithography/Pretreatment#250_C_oven_for_pretreatment|250C Oven for Pretreatment]]
===[[Specific Process Knowledge/Lithography/Coaters|Coaters]]===
*[[Specific Process Knowledge/Lithography/Coaters#SSE Spinner|SSE Spinner]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]
*[[Specific Process Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]]
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner (Polymers)|Manual Spinner (Polymers)]]
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner 1 (Laurell)|Manual Spinner 1 (Laurell)]]
*[[Specific Process Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]
===[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]===
*[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner-6inch|Aligner-6inch]]
*[[Specific Process Knowledge/Lithography/UVExposure#III-V Aligner|III-V Aligner]]
*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV lamp]]
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===[[Specific Process Knowledge/Lithography/Baking|Baking]]===
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]
===[[Specific Process Knowledge/Lithography/Development|Development]]===
*[[Specific Process Knowledge/Lithography/Development#Automatic Developer Bench for 4" and 6"|Developer Bench]]
===[[Specific Process Knowledge/Lithography/Strip|Strip]]===
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 1|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Strip#III-V Plasma Asher|III-V Plasma Asher]]
*[[Specific Process Knowledge/Lithography/Strip#Rough Acetone Strip|Rough Acetone Strip]]
*[[Specific Process Knowledge/Lithography/Strip#Fine Acetone Strip|Fine Acetone Strip]]
===[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]===
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOffWetBench|Lift-off Wet Bench]]
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOff(4",6")|Lift-off (4", 6")]]
===[[Specific Process Knowledge/Lithography/WaferCleaning|Wafer Cleaning]]===
*[[Specific Process Knowledge/Lithography/WaferCleaning#Spindryers|Spin dryers]]
|}
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==[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]==
*[[Specific Process Knowledge/Lithography/DUVStepper#SÜSS Spinner-Stepper|SÜSS Spinner-Stepper]]
*[[Specific Process Knowledge/Lithography/DUVStepper#Process information|Process information]]
*[[Specific Process Knowledge/Lithography/DUVStepper#DUV Stepper FPA-3000EX4 from Canon|DUV Stepper FPA-3000EX4 from Canon]]
*[[Specific Process Knowledge/Lithography/DUVStepper#Process information|Process information]]
*[[Specific Process Knowledge/Lithography/DUVStepper#Overview of performance|Overview of performance]]
==[[Specific Process Knowledge/Lithography/EBeamLithography|E-Beam Lithography]]==
*[[Specific Process Knowledge/Lithography/EBeamLithography#Performance of the e-beam writer|Performance]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#Getting started|Getting started]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#E-beam resists and Process Flows|E-beam resists and Process Flows]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#Proximity Error Correction|Proximity Error Correction]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#Charging of non-conductive substrates|Charging of non-conductive substrates]]
==[[Specific Process Knowledge/Lithography/NanoImprintLithography|NanoImprint Lithography]]==
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#Molecular Vapour Deposition|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#ObducatNIL|Obducat NIL]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|EVG NIL]]
==[[Specific Process Knowledge/Lithography/3DLithography|3D Lithography]]==
*[[Specific Process Knowledge/Lithography/3DLithography#2-Photon Polymerization|2-Photon Polymerization]]
|}

Revision as of 12:13, 14 October 2013

3rd Level - Material/Methode

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Choose material to deposit

Dielectrica

Metals/elements

Period/Group

IVB VB VIB VIIIB IB IIIA IVA
3 . . . . . 13 Al Aluminium 14 Si Silicon
4 22 Ti Titanium . 24 Cr Chromium 28 Ni Nickel 29 Cu Copper . 32 Ge Germanium
5 . . 42 Mo Molybdenum 46 Pd Palladium 47 Ag Silver . 50 Sn Tin
6 . 73 Ta Tantalum 74 W Tungsten 78 Pt Platinum 79 Au Gold . .

Alloys


Polymers

  • SU8
  • Antistiction coating
  • Topas
  • PMMA

Choose deposition equipment


!!!

UV Lithography

Pretreatment

Coaters

UV Exposure

Baking

Development

Strip

Lift-off

Wafer Cleaning

DUV Stepper Lithography

E-Beam Lithography

NanoImprint Lithography

3D Lithography