Specific Process Knowledge/Thin film deposition/Furnace LPCVD TEOS
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B3 LPCVD TEOS furnace

DTU Nanolab has one LPCVD (Low Pressure Chemical Vapor Deposition) TEOS furnace, in LabManager "Furnace: LPCVD TEOS (B3)".
The furnace is a Tempress horizontal furnace (installed in 1995). The process is a batch process, where TEOS oxide can be deposited on up to 15 4" wafers at a time.
TEOS is tetraethoxysilane, and TEOS oxide is a silicon dioxide based on this reactive chemical that during deposition condenses on the sample surface. The deposition takes place at a temperature of 712-720 oC (there is a small temperature gradient over the furnace tube).
It is possible to anneal TEOS oxide layers to increase the density and thus improve the electrical properties as well as the chemical resistance. The electrical characteristics may also be improved by the addition of O2 during the deposition process.
LPCVD TEOS oxide has an excellent step coverage and is very good for trench filling, however very small nanometer trenched and/or very deep trenches will be challenging to fill. The film thickness over the wafers is very uniform.
More information about the TEOS oxide deposition process can be found here:
Deposition of TEOS oxide using LPCVD
The user manual(s), quality control procedure(s) and results, technical information and contact information can be found in LabManager:
No quality control is done for the LPCVD TEOS oxide furnace
Manual for the furnace computer to the A, B, C and E stack furnaces
The A, B, C and E stack furnaces can be controlled either from a touch screen by each furnace or from a furnace computer.
The user manual for the furnace computer can be found here:
Process knowledge
Please take a look at the process side for deposition of TEOS oxide:
Deposition of TEOS using LPCVD
Purpose |
Deposition of TEOS oxide | |
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Performance | Film thickness |
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Step coverage |
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Film quality |
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Process parameter range | Process temperature |
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Process pressure |
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Gas flows |
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Substrates | Batch size |
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Substrate materials allowed |
Note:
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