Specific Process Knowledge/Lithography/EBeamLithography/EBLLandingpage: Difference between revisions
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Since substrate preparation and development processes are (nearly) identical for the JEOL and Raith eLine systems they are described in common below. Pattern preparation, job preparation and job execution are fairly different between the two tools and hence these steps are described on the specific tool pages. | Since substrate preparation and development processes are (nearly) identical for the JEOL and Raith eLine systems they are described in common below. Pattern preparation, job preparation and job execution are fairly different between the two tools and hence these steps are described on the specific tool pages. | ||
== Substrate preparation == | |||
An appropriate EBL resist must naturally be applied to the substrate. DTU Nanolab supplies a number of standard resists, please consult the table below. The default positive EBL resist is AR-P 6200.09 (CSAR). | |||
== Development == | |||
= E-beam resists = | = E-beam resists = | ||