Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
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* '''Prepare a process flow''' which describes all steps in your UV lithography process. You can find docx-templates <u>[[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|in this table]]</u>. | * '''Prepare a process flow''' which describes all steps in your UV lithography process. You can find docx-templates <u>[[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|in this table]]</u>. | ||
* '''Design device''': Design your device and layout. A detailed instruction on how to design a layout can be found <u>[[Specific_Process_Knowledge/Pattern_Design|here]]</u>. | * '''Design device''': Design your device and layout. A detailed instruction on how to design a layout (mask) can be found <u>[[Specific_Process_Knowledge/Pattern_Design|here]]</u>. | ||
* '''Substrate pretreatment''': In many processes it is recommended to <u>[[Specific_Process_Knowledge/Lithography/Pretreatment|pretreat or prime]]</u> your wafer before spin-coating. In some <u>[[Specific_Process_Knowledge/Lithography/Coaters|spin-coaters]]</u>, these pretreatment processes are included in the spin coating of resist. | * '''Substrate pretreatment''': In many processes it is recommended to <u>[[Specific_Process_Knowledge/Lithography/Pretreatment|pretreat or prime]]</u> your wafer before spin-coating. In some <u>[[Specific_Process_Knowledge/Lithography/Coaters|spin-coaters]]</u>, these pretreatment processes are included in the spin coating of resist. | ||