Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
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# '''Thickness of resist''': In general, it is recommended to work with an aspect ratio of ~1, i.e. where the width of the pattern is of same size than the thickness of the resist. Furthermore, when you decide for the resist thickness, consider which transfer you need: | # '''Thickness of resist''': In general, it is recommended to work with an aspect ratio of ~1, i.e. where the width of the pattern is of same size than the thickness of the resist. Furthermore, when you decide for the resist thickness, consider which transfer you need: | ||
#* For [[Specific_Process_Knowledge/Lithography/LiftOff|lift-off]] processes, we recommend resist thicknnesses ~5 times larger than the thickness of the metal to be lifted. | #* For [[Specific_Process_Knowledge/Lithography/LiftOff|lift-off]] processes, we recommend resist thicknnesses ~5 times larger than the thickness of the metal to be lifted. | ||
#* For dry or wet etch processes, | #* For dry or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist. | ||
# '''Mask''': Design and order a photomask for your UV process. A detailed instruction on how to design and order a photomask can be found [[Specific_Process_Knowledge/Lithography/Pattern_Design_and_Mask_Fabrication#Mask_Fabrication|here]]. | # '''Mask''': Design and order a photomask for your UV process. A detailed instruction on how to design and order a photomask can be found [[Specific_Process_Knowledge/Lithography/Pattern_Design_and_Mask_Fabrication#Mask_Fabrication|here]]. | ||
# '''Substrate pretreatment''': In many processes it is recommended to [[Specific_Process_Knowledge/Lithography/Pretreatment|pretreat]] your wafer before spin-coating. In some spin-coaters, these pretreatment processes are included in the spin coating of resist. If you use either the '''RCD8, SSE or a manual spin coater''', you should book equipment for pretreatment prior to spin coating. | # '''Substrate pretreatment''': In many processes it is recommended to [[Specific_Process_Knowledge/Lithography/Pretreatment|pretreat]] your wafer before spin-coating. In some spin-coaters, these pretreatment processes are included in the spin coating of resist. If you use either the '''RCD8, SSE or a manual spin coater''', you should book equipment for pretreatment prior to spin coating. | ||