Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-1

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Unless otherwise stated, the content of this page was created by the dry etch group at DTU Nanolab


DRIE-Pegasus 1

The DRIE-Pegasus 1 load lock and cassette loader in the Nanolab cleanroom A-1. Photo: DTU Nanolab internal

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Equipment info in LabManager

Process information

Standard recipes

Hardware changes

A few hardware modifications have been made on the Pegasus since it was installed in 2010. The changes are listed below.


Other etch processes

More processes, such as for DUV resist, are currently being developed, but they are not quite 'ready for publication' at LabAdviser so please contact Jonas (mailto:jmli@dtu.dk) for more information.



Advanced Processing - Henri Jansen style

Wafer bonding

To find information on how to bond wafers or chips to a carrier wafer, click here.


Characterisation of etched trenches

Comparing differences in etched trenches requires a set of common parameters for each trench. Click HERE to find more information about the parameters used on the DRIE-Pegasus process development.


Internal Nanolab Process log for Pegasus 1

Process log at Nanolab [1]

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