Specific Process Knowledge/Lithography

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Lithography index.php?title=Category:Lithography

There are four different types of lithography available at DTU Nanolab:


Comparing lithography methods at DTU Nanolab

UV Lithography DUV Stepper Lithography E-beam Lithography Nano Imprint Lithography
Generel description Pattern transfer via ultraviolet (UV) light Pattern transfer via deep ultraviolet (DUV) light Patterning by electron beam Pattern transfer via hot embossing (HE)
Pattern size range

~0.6 µm and up
(resist type, thickness, and pattern dependent)

~200 nm and up
(pattern type, shape and pitch dependent)

~12 nm - 1 µm
(and larger at high currents)

~20 nm and up

Resist type

UV sensitive:

  • AZ 5214E, AZ 4562, AZ MiR 701 (positive)
  • AZ 5214E, AZ nLOF 2020, SU-8 (negative)

DUV sensitive

  • JSR KRF M230Y, JSR KRF M35G (positive)
  • UVN2300-0.8 (negative)

E-beam sensitive

  • AR-P6200 CSAR, ZEP502A , PMMA (positive)
  • HSQ, mr-EBL, AR-N 7520 (negative)

Imprint polymers:

  • Topas
  • PMMA
  • mr-I 7030R
Resist thickness range

~0.5 µm to 200 µm

~50 nm to 2 µm

~30 nm to 1 µm

~ 100 nm to 2 µm

Typical exposure time

10 s - 3 min pr. wafer using mask aligners
10 min - 5 hours pr. wafer using maskless aligners

Process dependent:

  • Pattern
  • Pattern area
  • Dose

Throughput is up to 60 wafers/hour

Process dependent:

  • Dose, Q [µC/cm2]
  • Beam current, I [A]
  • Pattern area, a [cm2]

time [s] = Q*a/I

Process dependent, including heating/cooling rates

Substrate size
  • chips down to 3 mm x 3 mm
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers

We have cassettes fitting:

  • 4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
  • 6 wafers of 50 mm in size
  • 3 wafers of 100 mm in size
  • 1 wafer of 150 mm in size
  • 1 wafer of 200 mm in size

Only one cassette can be loaded at a time

  • small samples
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials

Any standard cleanroom material

Any standard cleanroom material

Any standard cleanroom material, except:

  • Materials that will degas
  • Graphene requires special treatment

Any standard cleanroom material


Equipment Pages

Resist

Pretreatment

Coating

Baking

UV Exposure Tools

Deep-UV Exposure

Electron Beam Exposure

Nano Imprint Lithography


Development

Descum

Lift-off

Strip


Lithography Tool Package Training

DTU Nanolab offers a Tool Package Training in Lithography (TPT Lithography). You are required to pass this course, in order to get access to the lithography equipment inside the DTU Nanolabs cleanroom facility. The course includes theory on lithographic processes and training videos for specific equipment. The theory part consists of lecture videos followed by quizzes for each section. Once that part has been completed successfully, you can begin the online training for the lithography equipment you need to use. After completing the online training, you can request hands-on training for the lithography equipment inside the cleanroom via training@nanolab.dtu.dk.

The course is available via DTU Learn. You sign up for the course by enrolling yourself in the course here.


Course Description

  1. Online lecture videos
  2. Quizzes for each section
  3. Equipment-related training videos
  4. Hands-on training

Hands on training can be requested via training@nanolab.dtu.dk.


Learning objectives

Learn about the fundamentals of lithography processing in a cleanroom fabrication lab:

  • Coating
  • Exposure
  • Development
  • Resist, substrates and pre-treatment
  • Post-lithography steps


Knowledge and Information about Lithography

Literature


Lecture videos

  • Lithography TPT lecture videos:
    • Current version (6 videos, 1:28 hours:minutes in total) on YouTube
    • Old version (7 videos, 2:41 hours in total) on YouTube
  • A full lecture series from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)

Training videos

Playlists on YouTube:


Manuals
NB: Access to manuals require login


Process Flows


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