LabAdviser/Technology Research

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Unless otherwise stated, this page is written by DTU Nanolab internal

The aim of this page is to give an overview of the technology research going on in the cleanroom and the other laboratories facilitated by DTU Nanolab. Here technology research projects will be presented. This includes a project description and links to other pages in LabAdviser where the process development outcome from these projects can be found. We urge all our users that do technology research at these facilities to present their activities here. At DTU Nanolab we commit our selves to present the technology research that we initiate to share the outcome with our users, as this is the main purpose for this research.

Presentation Form for Presenting Technology Research:

Presentation Form

If you perform technology research in the DTU Nanolab facilities, please contribute to this overview page. Start by contacting Berit Herstrøm.

Current Projects - Fabrication

Silicon Microtechnology

Technology for CZTS-Silicon Tandem Solar Cells - initiated June 2017 - Alireza Hajijafarassar

Current Projects - Characterization

Nanostructure and Functionality

Quantitative electron microscopy of 2D materials - initiated September 2018 - Anton Bay Andersen
High-resolution transmission electron microscopy of catalytic nanoparticle surfaces - initiated December 2019 - William Bang Lomholdt
Synthesis and nanoscale characterization of ultrathin and ultrasmooth metal films - initiated December 2017 - Mario Frederik Heinig

Molecular Windows

Live TEM imaging of Nanowire growth and device dynamics - initiated December 2018 - Christopher Røhl Andersen

Electron Matter Interactions

Soft Matter

Completed Projects - Fabrication

Plasmonics and Metamaterials

Fabrication of Hyperbolic Metamaterials using Atomic Layer Deposition - initiated November 2013 - Evgeniy Shkondin

Advanced Nanomachining

Technology Development of 3D Silicon Plasma Etching process for Novel Devices and Applications - initiated November 2015 - Bingdong Chang

Biomaterial Microsystems

Polymer Microsystems

Silicon Microtechnology

Microfabrication of X-ray optical elements - initiated February 2017 - Chantal Silvestre
Nanofabrication of Inductive Components for Integrated Power Supply On Chip - initiated November 2014 Hoà Lê Thanh
Microfabrication of Hard x-ray Lenses - initiated December 2012 - Frederik Stöhr

Completed Projects - Characterization

Nanostructure and Functionality

Nanoscale characterization of ultra-thin metal films for nanofabrication applications - initiated November 2014 - Matteo Todeschini

Molecular Windows

Electron Matter Interactions

Organic Ice Resists for Electron-Beam Lithography - Instrumentation and Processes - initiated November 2014 - William Tiddi

Soft Matter

Completed 3 week projects

Report date	Supervisor	students	Short abstract	File link	Keywords
The plan is to upload 3-week courses report that have been carried out at Danchip. Please upload your 3-week reports if you agree this is a good idea.
2018-11	jehan@dtu.dk khara@dtu.dk flje@dtu.dk	Jens Hemmingsen s135101	X-ray imaging is a widely used non-invasive imaging technique, with applications in fields such as materials science, medicine or even food quality control, where the ability to detect foreign objects can be critical. X-rays have the ability to transmit through many materials with ab- sorption rates dependent on the material density, which is used to create traditional absorption x-ray images. The ability to transmit through materials is, however, a fundamental problem for any application that requires focusing of the x-rays, since the x-rays will transmit through traditional optical lenses, without any significant refraction. Focusing of x-rays is currently done by consecutive stacking of beryllium lenses, in what is known as a compound lens, but as the x-ray sources have improved over time, the inherent refractive grain structure in the beryllium lenses have become a source of degradation of the coherence of the beam.	Media:Diamant2018_v5.pdf	3D laser micro machining, laser milling, diamond, x-ray, lens, CRL
2018-07	jehan@dtu.dk reet@dtu.dk	Martin Schjeldrup Jessen s153298 Christoffer Emil Kurt Tost Jensen s152358	The purpose of the project is to investigate sputter deposition of materials under varying conditions. It was investigated how the different parameters of Physical Vapor Deposition affects the rate and quality of the deposition. This was investigated using series of experiments designed to create a surface response model for each of the materials tested. This project will also cover what methods are ideal to use for measuring the thickness of a deposition.	Media:Lesker_rapport_3w_july_2018.pdf‎	sputtering, lesker, thin film, characterization, ...
2018-06-21	bghe@danchip.dtu.dk taran@danchip.dtu.dk	Martin Riis s181169 Teitur Hansen s173963 Nataniel Andresas Olden-Jørgensen s163936	The purpose of the project is optimize the lithography process on Si/SiO2 wafers to obtain straight sidewalls for dry plasma etching. In the project we experience adhesion problems and undercut of the resist at the interface to the sample. Several tests were performed in order to overcome this problem.	Media:New_3_Week_Course.pdf	UV lithography
2017-06-22	pevo@danchip.dtu.dk mdyma@danchip.dtu.dk tanamp@dtu.dk	Asger Sommer s153889 Christoffer E. K. T. Jensen s152358 Rikke Bagge s151728	The purpose of the project is develop an optimized recipe for deposition of aluminium nitride (AlN) in the PEALD at Danchip. TMA and NH3 plasma have been used as precursors. A good quality AlN film should have a decent deposition rate, a high uniformity, a low roughness, a low amount of particles and a small amount of impurities (especially of oxygen and carbon). The deposited AlN layers have been characterized using a particle scanner, ellipsometry, AFM, SEM and XPS. AlN has been deposited on wafers, and the best recipe have been chosen for deposition on samples with high aspect ratio trenches. To limit the amount of depositions the design of experiment (DOE) software JMP has been used to select a number of different recipe parameters. JMP has also been used to evaluate the results.	PEALD deposition of AlN using TMA and NH3	PEALD, AlN, DOE, characterization
2017-06-22	chasil@danchip.dtu.dk	Andreas R. Stilling-Andersen s163397 Kristine Børsting s153299	In this 3-weeks course, the student will be working on the micro-fabrication of a Silicon/Gold grating for X-Ray optics. The fabrication of these devices require the usage of standard UV lithography combine with DRIE of silicon and metal thermal evaporation. The optimized DRIE Bosch process creates a fluorocarbon (FC) layer deposited homogeneously along the sidewall of the trench. While the depth of the trench increases with the dry etch number of cycles, an FC layer is accumulating at the top of the trench. This protrusion allows for shadow masking the sidewalls during thermal evaporation of gold, in order to deposit a seed layer at the bottom of the trench allowing for subsequent metallization by electroplating. The student will be designing a simple mask using the software CleWin. The mask will be pattern on a UV resist (5214E) using the Maskless aligner available at DTU Danchip. They will also calculate how deep the trench should be to get a minimum absorption of 92% of the intensity of the X-Ray energy.	Microfabrication of X-Ray optics	DRIE, Lithography, CleWin, Characterization
2017-06-21	Bingdong Chang bincha@dtu.dk	Benjamin Lundgren Larsen s164006 Mathias Hoeg Boisen s164000	Using the Black Silicon Method to Monitor the Reproducibility of Plasma Etching Processes	Black silicon	RIE, Plasma etching, process reproducibility
2017-01-18	Bingdong Chang bincha@dtu.dk	Keld Fernstrøm s144075 Asger Steen Nielsen s150369	Precise Timing Control in Deep Reactive Ion Etching (DRIE) with Bosch Process	Etching time control	DRIE, Plasma Etching
2016-06-22	Bingdong Chang bincha@dtu.dk	Christian Dam Vedel s153721 Kitty Steenberg s141812 Mette Bybjerg Brock s134252	High Resolution Pattern Definition with E-beam Lithography	EBL pattern with HSQ	E-beam lithography
2016-01-20	mattod@danchip.dtu.dk pevo@danchip.dtu.dk pewin@danchip.dtu.dk	Gustav Juhl Johansen s134266 William Band Lomholt s4269	In-situ imaging of the ALD film growth mechanism can be done in an environmental TEM (eTEM), but it is very important to understand if the gas phase reactions can contaminate the microscope. For this reason a small ALD system with a chamber size corresponding to the specimen area of the eTEM has been build. With this chamber ALD depositions of platinum can be studied and optimized. In this project the software LabView has been used to program a Virtual Intstument (VI) that can control the different components of the hardware on the ALD system. With the software it is also possible to define the parameters for an ALD deposition process. The different programming steps are described in details in the report. Furhermore, the ALD deposition principle is described in the report.	Programming the Control Software of an Atomic Layer Deposition System	ALD, LabView
2015-06-25	pevo@danchip.dtu.dk mdyma@danchip.dtu.dk	Daniel Anyaogu s134258 Emil Ludvigsen s134254	DRIE etching of deep structures in silicon samples results in rough sidewalls with scallops that for many applications are very undesirable. It has been shown that scallops can be removed by use of hydrogen annealing as the surface mobility of the silicon atoms then enhances. In this project silicon samples with DRIE etched micro trenches have then been annealed in the ATV Furnace and the Black Magic PECVD. The annealing has been done at high temperatures and both at atmospheric pressure and vacuum. Prior to the annealing some of the sample have been RCA cleaned. To evaluate the effect of the annealing the samples have been inspected using SEM.	Hydrogen Annealing for Removal of Scallops after DRIE	DRIE, scallops, hydrogen annealing
2015-06-24	jehan@danchip.dtu.dk	Zakaria Abachri (s134237) Rune Sixten Grass (s134243)	The purpose of this project and following journal is to characterise the material thickness produced using parameters such as pressure, power and ratio of source materials used in magnetron sputtering of silicon wafers on the sputter system in DTU Danschips cleanroom. We want to investigate and optimize the sputter deposition process and map how the parameters affects the thickness of different types of metals, dielectrics or semiconductors on silicon wafers. The thickness will be measured in-situ by an ellipsometer layer by layer by fitting different types of material models to the data, which in turn predict the growth rate for each layer. An ex-situ measurement of the total multilayer thickness will also be carried out as a comparison to the model fit.	Optimization of thin film deposition using in-situ ellipsometry	ellipsometry, thin film, in-situ, sputtering, lesker
2015-08-05	jehan@danchip.dtu.dk rkc@danchip.dtu.dk	Jens Hemmingsen s135101	Laser ablation is a method used to remove material from a solid surface, by irradiating it with a laser beam. The material directly underneath the beam is heated and then evaporates. The process can be compared to old fashioned machine milling, in which a rotary tool is used to remove material from a solid surface, and indeed laser ablation is also known as laser micromachining. There are a lot of different, sometimes interdependent, process parameters used in the milling process, which means that the ablation removal rate often depends on the specific design pattern used in a particular job. The goal of this project is to reduce the need for design-specific process optimization or to find ways to simplify the process optimization.	Laser micromachining of silicon microstructures	laser micro machining, silicon, dicing