Specific Process Knowledge

2nd Level - Process Topic

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Choose the process topic you are interested in

• Back-end processing

• Characterization

• Etch

• Imprinting

• Lithography

• Thermal Process

• Thin film deposition

• Wafer and sample drying

• Wafer Bonding

• Wafer Cleaning

• Wafer Information

• III-V Process

Overview of sample processing

Clean the sample

Drying Samples

Make a layer on the sample or Film Formation
Thermal Oxide growth
Physical Vapour Deposition
	Sputter deposition
	Thermal deposition
	E-beam evaporation
CVD
	LPCVD
	PECVD
Coating
	Spin coating
	Spray coating
Electroplating
Epitaxial growth

Thermal treatment of the sample

Make a mask on the sample
Lithography
Imprinting

Transfer pattern into the sample
Wet etch
Dry etch
Lift-off

Direct structure definition
Imprinting
LASER machining
Lithographic definition
Polymer Injection molding

Bonding samples together

Characterize the sample

Back end of the sample
Chip/die mounting
Wire bonding
Dicing

Overview of sample processing 2

Clean the sample	Drying Samples	Film Formation Thermal Oxide growth Thin Film deposition Sputter deposition Thermal deposition E-beam evaporation CVD LPCVD PECVD Coating Spin coating Spray coating Electroplating Epitaxial growth	Thermal treatment of the sample
Make a mask on the sample Lithography Imprinting	Transfer pattern into the sample Wet etch Dry etch Lift-off	Direct structure definition Imprinting LASER machining Lithographic definition Polymer Injection molding	Bonding samples together
Characterize the sample	Back end of the sample Chip/die mounting Wire bonding Dicing

Overview of sample processing 3

Clean your sample
Entry page in LabAdviser	Techniques	Materials
Wafer cleaning	Soap Sonic	Removes dust and particles
	7-up & Piranha	Removes organics and alkali ions
	RCA	Two step process to remove organics and metals
	5% HF	Removes native oxide
	IMEC	Removing dust, organics and alkali ions and slightly polish the surface. Make the surface hydrophillic

Dry your sample
Entry page in LabAdviser	Techniques	Materials
Wafer and sample drying	Spin dryers	Whole wafers
	Critial point dryer	Sensitive wafers

Create a layer/film on your sample
Entry page in LabAdviser	Techniques	Materials
Thermal Process/Oxidation	Thermal oxidation	Thermal SiO2
Thin film deposition
	Sputter deposition	Si,SiO2,Si3N3,TiO2, metals
	Thermal evaporation	Al, ?
	E-beam evaporation	Metals
	LPCVD	Si3N4, SRN, SiO2, Si (poly and amorph)
	PECVD	Si3N4, SiO2, PBSG
	Electroplating	Ni
Lithography/Coaters
	Spin coating	resists, polymers
	Spray coating	resists, polymers
Epitaxial growth	MOCVD	?

Dope your sample
Entry page in LabAdviser	Techniques	Materials
Thin film deposition/PECVD	PECVD	Deposition of SiO2 or Si3N4 doped with P,B and Ge
Thin film deposition/Furnace LPCVD PolySilicon	LPCVD	Deposition of PolySi doped with B or P
Thermal Process/Dope with Boron	Predeposition and drive-in	Doping Silicon wafers with boron
Thermal Process/Dope with Phosphorus	Predeposition and drive-in	Doping Silicon wafers with phosphorus
Ionimplant		?

Thermal treatment of your sample
Entry page in LabAdviser	Techniques	Materials

Make a mask on your sample
Entry page in LabAdviser	Techniques
Lithography
	Photolithography
	Deep UV lithography
	E-beam lithography
	Imprinting

Transfer mask pattern to your sample
Entry page in LabAdviser	Techniques	Materials
Etch
	Wet etch	Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
	Dry etch	Any material
Lift-off		?

Define your structure directly to your sample
Imprinting
LASER machining
Lithographic definition
Polymer Injection molding

Bond your samples together
Entry page in LabAdviser	Techniques	Materials

Characterize your sample
Entry page in LabAdviser	Techniques	Materials

Pack your sample (back-end)
Chip/die mounting
Wire bonding
Dicing