2nd Level - Process Topic
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Overview of sample processing 3
Clean your sample
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Entry page in LabAdviser
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Techniques
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Materials
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Wafer cleaning
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Soap Sonic
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Removes dust and particles
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7-up & Piranha
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Removes organics and alkali ions
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RCA
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Two step process to remove organics and metals
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5% HF
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Removes native oxide
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IMEC
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Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
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Dry your sample
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Entry page in LabAdviser
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Techniques
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Materials
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Wafer and sample drying
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Spin dryers
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Whole wafers
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Critial point dryer
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Sensitive wafers
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Entry page in LabAdviser
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Techniques
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Materials
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Thermal Process/Oxidation
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Thermal oxidation
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Thermal SiO2
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Thin film deposition
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Sputter deposition
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Si,SiO2,Si3N3,TiO2, metals
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Thermal evaporation
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Al, ?
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E-beam evaporation
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Metals
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LPCVD
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Si3N4, SRN, SiO2, Si (poly and amorph)
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PECVD
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Si3N4, SiO2, PBSG
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Electroplating
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Ni
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Lithography/Coaters
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Spin coating
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resists, polymers
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Spray coating
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resists, polymers
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Epitaxial growth
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MOCVD
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?
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Entry page in LabAdviser
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Techniques
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Materials
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Thermal Process
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Annealing
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Si, PECVD layers
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Oxidation
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Si wafers
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Doping with B/P
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Si wafers
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Pyrolysis
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Resists?
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Entry page in LabAdviser
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Techniques
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Lithography
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Photolithography
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Deep UV lithography
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E-beam lithography
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Imprinting
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Entry page in LabAdviser
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Techniques
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Materials
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Etch
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Wet etch
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Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
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Dry etch
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Any material
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Lift-off
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?
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Imprinting
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LASER machining
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Lithographic definition
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Polymer Injection molding
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Entry page in LabAdviser
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Techniques
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Materials
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Entry page in LabAdviser
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Techniques
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Materials
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Chip/die mounting
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Wire bonding
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Dicing
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Overview of sample processing 4
Clean your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Wafer cleaning
|
Soap Sonic
|
Removes dust and particles
|
|
7-up & Piranha
|
Removes organics and alkali ions
|
|
RCA
|
Two step process to remove organics and metals
|
|
5% HF
|
Removes native oxide
|
|
IMEC
|
Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
|
|
Dry your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Wafer and sample drying
|
Spin dryers
|
Whole wafers
|
|
Critial point dryer
|
Sensitive wafers
|
|
Create a layer/film on your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Thermal Process/Oxidation
|
Thermal oxidation
|
Thermal SiO2
|
Thin film deposition
|
|
|
|
Sputter deposition
|
Si,SiO2,Si3N3,TiO2, metals
|
|
Thermal evaporation
|
Al, ?
|
|
E-beam evaporation
|
Metals
|
|
LPCVD
|
Si3N4, SRN, SiO2, Si (poly and amorph)
|
|
PECVD
|
Si3N4, SiO2, PBSG
|
|
Electroplating
|
Ni
|
|
Epitaxial growth /MOCVD
|
?
|
Lithography/Coaters
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|
|
|
Spin coating
|
resists, polymers
|
|
Spray coating
|
resists, polymers
|
|
|
Thermal treatment of your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Thermal Process
|
Annealing
|
Si, PECVD layers
|
|
Oxidation
|
Si wafers
|
|
Doping with B/P
|
Si wafers
|
|
Pyrolysis
|
Resists?
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Make a mask on your sample
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Entry page in LabAdviser
|
Techniques
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Lithography
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Photolithography
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Deep UV lithography
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E-beam lithography
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Imprinting
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Transfer mask pattern to your sample
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Entry page in LabAdviser
|
Techniques
|
Materials
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Etch
|
|
|
|
Wet etch
|
Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
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|
Dry etch
|
Any material
|
Lithography/Lift-off
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|
?
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Define your structure directly
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Imprinting
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LASER machining
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Lithographic definition
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Polymer Injection molding
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Bond your samples together
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Entry page in LabAdviser
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Techniques
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Materials
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Characterize your sample
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Entry page in LabAdviser
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Techniques
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Materials
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Pack your sample (back-end)
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Chip/die mounting
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Wire bonding
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Dicing
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jmli test