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Clean your sample
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Dry your sample
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Create a thin film on your sample
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Dope your sample
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Thermal treatment of your sample
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Make a mask on your sample
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Transfer pattern to your sample
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Define your structure directly File:Jehandefine.jpg
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Bond your samples together
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Characterize your sample
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Pack your sample
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Process flow examples
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| Clean your sample Clean your sample
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| Entry page in LabAdviser
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Techniques
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Materials
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| Wafer cleaning
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Soap Sonic
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Removes dust and particles
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| 7-up & Piranha
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Removes traces of organics and alkali ions
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| RCA
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Two step process to remove traces of organics and metals
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| 5% HF
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Removes native oxide
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| IMEC
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Removing dust, traces of organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
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| Dry your sample Dry your sample
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| Entry page in LabAdviser
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Techniques
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Materials
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| Wafer and sample drying
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Spin dryers
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Whole wafers
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| Critial point dryer
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Sensitive wafers
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| Ethanol fume drying
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Sensitive wafers
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| N2 blow drying
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N2 pistols
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| Create a layer/film on your sample Create a layer/film on your sample
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| Entry page in LabAdviser
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Techniques
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Materials
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| Thermal Process/Oxidation
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Thermal oxidation
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Thermal SiO2
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| Thin film deposition
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Sputter deposition
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Metals: Al, Ti, Cr, Co, Ni, Cu, Mo, Pd, Ag, Sn, Ta, W, Pt, Au, Fe, Mg, Nb, Ru
Semiconductors: Si, Ge, ZnO
Oxides: SiO2, ITO, TiO2, Al2O3, MgO, Ta2O5 Cr2O3
Transparent Conducting Oxides: ITO, AZO
Alloys: TiW, NiCr, AlTi, NiV, AlCu, CoFe, CuTi, FeMn, MnIr, NiCo, NiFe, YSZ
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| Thermal evaporation
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Al, Ge, Ag
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| E-beam evaporation
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Metals: Ti, Cr, Al, Ni, Pt, Au, Mo, Nb, Pd, Ag, Cu, W, Ta
Semiconductors: Si, Ge
Oxides: SiO2, TiO2
Alloys: NiCr, TiAl
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| LPCVD
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Si3N4, SRN, SiO2, Si (poly and amorph)
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| PECVD
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Si3N4, SiO2, PBSG
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| MVD
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FDTS
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| Electroplating
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Ni
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| Epitaxial growth /MOCVD
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Al, As, Ga, In, P. doping: Si, Zn
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| Lithography/Coaters
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Spin coating
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resists, polymers
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| Spray coating
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resists, polymers
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| Thermal treatment of your sample Thermal treatment of your sample
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| Entry page in LabAdviser
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Techniques
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Materials
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| Thermal Process
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Annealing (>350C)
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Si, PECVD layers, Al, BCB curing, Polymer
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| Oxidation
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Si wafers
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| Doping with B/P
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Si wafers
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| Pyrolysis
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Resists: AZ, SU8, PDMS
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| Rapid Thermal Anneal (RTP)
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SiO2, Si3N4, Ti, III-V
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Lithography/Baking
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Baking (<300dg)
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baking resist and polymers
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| Make a mask on your sample Make a mask on your sample
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| Entry page in LabAdviser
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Techniques
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Materials
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| Lithography
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Pattern design & Mask fabrication
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| Photolithography
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UV resists
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| Deep UV lithography
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DUV resists
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| E-beam lithography
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E-beam resists
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| Imprinting
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Polymers
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| Transfer mask pattern to your sample Transfer mask pattern to your sample
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| Entry page in LabAdviser
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Techniques
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Materials
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| Etch
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Wet etch
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Si, Glass, SiO2, Si3N4, Al, Cr, Ti, Au, Pt, InP, InGaAsP, GaAs/AlGaAs
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| Dry etch
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Any material
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| Lithography/Lift-off
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Lift-off
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Most materials
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Define your structure directly
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| Entry page in LabAdviser
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Techniques
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Materials
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| Direct Structure Definition
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Polymer Injection molding
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Topas, PP, PE, PS
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| LASER micro machining
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Silicon, Metal, Graphene (on silicon), Glass (Pyrex, fused silica), TOPAS, PMMA
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| Dicing saw
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Silicon, Glass (Pyrex, fused silica)
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| Imprinting
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TOPAS, PMMA
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| Hot Embosser
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Topas, PP, PE, PS, PC, PMMA, ...
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| Lithography definition
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SU8, AZ resists
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