Specific Process Knowledge

2nd Level - Process Topic

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Choose the process topic you are interested in

• Back-end processing

• Characterization

• Direct Structure Definition

• Doping

• Etch

• Imprinting

• Lithography

• Thermal Process

• Thin film deposition

• Wafer and sample drying

• Wafer Bonding

• Wafer Cleaning

• Wafer Information

• III-V Process

Overview of sample processing 4

Clean your sample Entry page in LabAdviser Techniques Materials Wafer cleaning Soap Sonic Removes dust and particles 7-up & Piranha Removes organics and alkali ions RCA Two step process to remove organics and metals 5% HF Removes native oxide IMEC Removing dust, organics and alkali ions and slightly polish the surface. Make the surface hydrophillic	Dry your sample Entry page in LabAdviser Techniques Materials Wafer and sample drying Spin dryers Whole wafers Critial point dryer Sensitive wafers	Create a layer/film on your sample Entry page in LabAdviser Techniques Materials Thermal Process/Oxidation Thermal oxidation Thermal SiO2 Thin film deposition Sputter deposition Si,SiO2,Si3N3,TiO2, metals Thermal evaporation Al, ? E-beam evaporation Metals LPCVD Si3N4, SRN, SiO2, Si (poly and amorph) PECVD Si3N4, SiO2, PBSG Electroplating Ni Epitaxial growth /MOCVD ? Lithography/Coaters Spin coating resists, polymers Spray coating resists, polymers
Dope your sample Entry page in LabAdviser Techniques Materials Thin film deposition/PECVD PECVD Deposition of SiO2 or Si3N4 doped with P,B and Ge Thin film deposition/Furnace LPCVD PolySilicon LPCVD Deposition of PolySi doped with B or P Thermal Process/Dope with Boron Predeposition and drive-in Doping Silicon wafers with boron Thermal Process/Dope with Phosphorus Predeposition and drive-in Doping Silicon wafers with phosphorus Doping Ion implant ?	Thermal treatment of your sample Entry page in LabAdviser Techniques Materials Thermal Process Annealing Si, PECVD layers Oxidation Si wafers Doping with B/P Si wafers Pyrolysis Resists?	Make a mask on your sample Entry page in LabAdviser Techniques Lithography Photolithography Deep UV lithography E-beam lithography Imprinting
Transfer mask pattern to your sample Entry page in LabAdviser Techniques Materials Etch Wet etch Si, Glass, SiO2, Si3N4, Al, Cr, Ti, Au, Pt, InP, InGaAsP, GaAs/AlGaAs Dry etch Any material Lithography/Lift-off ?	Define your structure directly Entry page in LabAdviser Techniques Materials Imprinting Imprinting Polymers Direct Structure Definition LASER machining Lithography Lithographic definition Resists Direct Structure Definition Polymer Injection molding Polymers	Bond your samples together Entry page in LabAdviser Techniques Materials Bonding Eutectic bonding Fusion bonding Anodic bonding
Characterize your sample Entry page in LabAdviser What do you need to measure? Technique/Method Characterization Sample Imaging, XY dimensions Microscopy: optical,SEM,AFM Sample Topography AFM,Profiling with stylus or optical Film thickness and optical constants Ellipsometry,Reflectometry,Prism Coupling Film Stress Profiling with stylus or optical Wafer thickness Element analysis XPS,EDX,SIMS Contact Angle Resistivity Four point probe Doping level/Carrier density Photoluminescence	Pack your sample (back-end) Entry page in LabAdviser Techniques Materials Back-end processing Chip/die mounting Wire bonding Dicing

Overview of sample processing 5

Clean your sample Techniques Materials Entry page in LabAdviser Soap Sonic Removes dust and particles Wafer cleaning 7-up & Piranha Removes organics and alkali ions RCA Two step process to remove organics and metals 5% HF Removes native oxide IMEC Removing dust, organics and alkali ions and slightly polish the surface. Make the surface hydrophillic	Dry your sample Techniques Materials Entry page in LabAdviser Spin dryers Whole wafers Wafer and sample drying Critial point dryer Sensitive wafers	Create a layer/film on your sample Techniques Materials Entry page in LabAdviser Thermal oxidation Thermal SiO2 Thermal Process/Oxidation Sputter deposition Si,SiO2,Si3N3,TiO2, metals Thin film deposition Thermal evaporation Al, ? E-beam evaporation Metals LPCVD Si3N4, SRN, SiO2, Si (poly and amorph) PECVD Si3N4, SiO2, PBSG Electroplating Ni Epitaxial growth /MOCVD ? Spin coating resists, polymers Lithography/Coaters Spray coating resists, polymers Lithography/Coaters
Dope your sample Entry page in LabAdviser Techniques Materials Thin film deposition/PECVD PECVD Deposition of SiO2 or Si3N4 doped with P,B and Ge Thin film deposition/Furnace LPCVD PolySilicon LPCVD Deposition of PolySi doped with B or P Thermal Process/Dope with Boron Predeposition and drive-in Doping Silicon wafers with boron Thermal Process/Dope with Phosphorus Predeposition and drive-in Doping Silicon wafers with phosphorus Doping Ion implant ?	Thermal treatment of your sample Entry page in LabAdviser Techniques Materials Thermal Process Annealing Si, PECVD layers Oxidation Si wafers Doping with B/P Si wafers Pyrolysis Resists?	Make a mask on your sample Entry page in LabAdviser Techniques Lithography Photolithography Deep UV lithography E-beam lithography Imprinting
Transfer mask pattern to your sample Entry page in LabAdviser Techniques Materials Etch Wet etch Si, Glass, SiO2, Si3N4, Al, Cr, Ti, Au, Pt, InP, InGaAsP, GaAs/AlGaAs Dry etch Any material Lithography/Lift-off ?	Define your structure directly Entry page in LabAdviser Techniques Materials Imprinting Imprinting Polymers Direct Structure Definition LASER machining Lithography Lithographic definition Resists Direct Structure Definition Polymer Injection molding Polymers	Bond your samples together Entry page in LabAdviser Techniques Materials Bonding Eutectic bonding Fusion bonding Anodic bonding
Characterize your sample Entry page in LabAdviser What do you need to measure? Technique/Method Characterization Sample Imaging, XY dimensions Microscopy: optical,SEM,AFM Sample Topography AFM,Profiling with stylus or optical Film thickness and optical constants Ellipsometry,Reflectometry,Prism Coupling Film Stress Profiling with stylus or optical Wafer thickness Element analysis XPS,EDX,SIMS Contact Angle Resistivity Four point probe Doping level/Carrier density Photoluminescence	Pack your sample (back-end) Entry page in LabAdviser Techniques Materials Back-end processing Chip/die mounting Wire bonding Dicing

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