Specific Process Knowledge/Lithography/UVLithography

UV Lithography uses ultraviolet light to transfer a pattern from a mask to a wafer coated with photoresist. The photoresist film is spin coated on the wafers and the pattern is transferred to the wafer by using a mask aligner. DTU Danchip houses a number of automatic or semi-automatic coaters and mask aligners.

Resist Overview

Resist	Polarity	Manufacturer	Comments	Technical reports	Spin Coating	Development	Rinse	Remover	Process flows (in docx-format)
AZ5214E	Positive			AZ5214E.pdf‎	SSE, KS Spinner, III-V Spinner
AZ4562	Positive			AZ4500.pdf‎	SSE, KS Spinner
AZ MiR 701	Positive			AZ_MiR_701.pdf‎	Spin Track 1 + 2				Process_Flow_AZ_MiR701.docx‎
AZ nLOF 2020	Negative			AZ_nLOF_2020.pdf‎	Spin Track 1 + 2				Process_Flow_AZ_nLOF_2020.docx‎
SU8	Positive				KS Spinner

UV Lithography Equipment

Pretreatment

• HMDS
• BHF
• 250C Oven for Pretreatment

Coaters

• SSE Spinner
• Spin Track 1 + 2
• KS Spinner
• Manual Spinner (Polymers)
• Manual Spinner 1 (Laurell)
• III-V Spinner
• Spray Coater

UV Exposure

• KS Aligner
• EVG Aligner
• III-V Aligner
• Inclined UV lamp

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Baking

• Hotplates
• Ovens

Strip

• Plasma Asher 1
• Plasma Asher 2
• III-V Plasma Asher
• Rough Acetone Strip
• Fine Acetone Strip

Lift-off

• Lift-off Wet Bench
• Lift-off (4", 6")

Wafer Cleaning

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