Specific Process Knowledge/Lithography: Difference between revisions
Appearance
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*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner (Laurell)|KS Spinner]] | *[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner (Laurell)|KS Spinner]] | ||
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner (Polymers)|Manual Spinner (Polymers)]] | *[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner (Polymers)|Manual Spinner (Polymers)]] | ||
===[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]=== | ===[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]=== | ||
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===[[Specific Process Knowledge/Lithography/Development|Development]]=== | ===[[Specific Process Knowledge/Lithography/Development|Development]]=== | ||
===[[Specific Process Knowledge/Lithography/ | |||
===[[Specific Process Knowledge/Lithography/Strip|Strip]]=== | |||
*[[Specific Process Knowledge/Lithography/Strip#PlasmaAsher1|Plasma Asher 1]] | |||
*[[Specific Process Knowledge/Lithography/Strip#PlasmaAsher2|Plasma Asher 2]] | |||
*[[Specific Process Knowledge/Lithography/Strip#III-VPlasmaAsher|III-V Plasma Asher]] | |||
*[[Specific Process Knowledge/Lithography/Strip#RoughAcetoneSTrip|Rough Acetone Strip]] | |||
*[[Specific Process Knowledge/Lithography/Strip#FineAcetoneSTrip|Fine Acetone Strip]] | |||
===[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]=== | |||
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOffWetBench|Lift-off Wet Bench]] | |||
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOff(4",6")|Lift-off (4", 6")]] | |||
===[[Specific Process Knowledge/Lithography/WaferCleaning|Wafer Cleaning]]=== | ===[[Specific Process Knowledge/Lithography/WaferCleaning|Wafer Cleaning]]=== | ||
===[[Specific Process Knowledge/Lithography/Characterization|Characterization]]=== | ===[[Specific Process Knowledge/Lithography/Characterization|Characterization]]=== | ||
===[[Specific Process Knowledge/Lithography/DirectLaserWriter|Direct Laser Writer]]=== | ===[[Specific Process Knowledge/Lithography/DirectLaserWriter|Direct Laser Writer]]=== | ||
Revision as of 13:30, 30 May 2013
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Available lithography methods at Danchip
There are a broad varity of lithography methods at Danchip. The methods are compared here to make it easier for you to compare and choose the one that suits your needs.
Comparing lithography methods at Danchip
| UV Lithography | DUV Lithography | E-beam Lithography | Imprint Lithography | Two photon polymerization Lithography | |
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| Generel description | Generel description - method 1 | Generel description - method 2 | 3 | 4 | 5 |
| Pattern size range |
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| Resist type |
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| Resist thickness range |
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| Typical exposure time |
2s-30s pr. wafer |
?-? pr. ? |
Depends on dose (in units of muC/cm2), estimate exposure time on sheet 2 of e-beam logbook |
? pr. wafer |
? pr. µm2 |
| Substrate size |
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We have cassettes that fit to
Only one cassette can be loaded at time |
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| Allowed materials |
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