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Specific Process Knowledge/Lithography/Strip: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,716 edits
 
Line 379: Line 379:
|-
|-
! scope=row style="text-align: left;" | Test results
! scope=row style="text-align: left;" | Test results
| Ashing rate follows temperature
| Ashing rate follows Power
|-
|-
! scope=row style="text-align: left;" | Wafers  
! scope=row style="text-align: left;" | Wafers  
Line 403: Line 403:
|-
|-
! scope=row style="text-align: left;" | Power
! scope=row style="text-align: left;" | Power
| 1000 W 
| Tested parameter
|-
|-
! scope=row style="text-align: left;" | Test processing time
! scope=row style="text-align: left;" | Test processing time
Line 409: Line 409:
|-
|-
! scope=row style="text-align: left;" | Test average temperature
! scope=row style="text-align: left;" | Test average temperature
| Tested parameter
| 40°C
|}
|}


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