Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions

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-==Thermal evaporator- A system for deposition of metals==
+==Thermal evaporator for metal deposition==
 [[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]]
-This evaporator is intuitive to operate and does not have a lot of bells and whistles. You can see the instrument specifications below.
+This instrument is NANO 36 Thermal evaporator from Kurt J. Lesker. Instrument specifications below. It takes around 1 hour for a round of deposition (depending on thickness and rate of course). The small chamber means that the deposited thickness may vary quite a bit across large samples, as further described in the specifications table.
-The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate. It can also be used for Cr evaporation for the same purpose, and evaporation of Ag, Au, Cu, and Ge. We have also attempted to evaporate Zn, but this resulted in heavy contamination of the chamber that required a lot of effort to clean and the process was not stable.
+The main purpose of this evaporator is to deposit Al for removing charging of the resist when doing electron beam lithography on insulating substrates. It can also be used for Cr evaporation for the same purpose. The advantage of Al is that it can be removed simultaneously with the e-beam resist. However Cr may allow even better resolution of the lithography.
+Additionally we have processes for evaporation of Ag, Au, Cu, and Ge. We have also attempted to evaporate Zn, but this resulted in heavy contamination of the chamber. You are always welcome to ask for other metals in the machine.
 Up to two sources can be present at the same time (metals in a boat, crucible or rod for evaporation) but there is only one power supply, so only one material can be evaporated at a time.