Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions
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==Thermal evaporator- A system for deposition of metals== | ==Thermal evaporator- A system for deposition of metals== | ||
[[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]] | [[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]] | ||
This evaporator is intuitive to operate and does not have a lot of bells and whistles. You can see the instrument specifications below. | |||
The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate. It can also be used for Cr evaporation for the same purpose, and evaporation of Ag, Au, Cu, and Ge. We have also attempted to evaporate Zn, but this resulted in heavy contamination of the chamber that required a lot of effort to clean and the process was not stable. | The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate. It can also be used for Cr evaporation for the same purpose, and evaporation of Ag, Au, Cu, and Ge. We have also attempted to evaporate Zn, but this resulted in heavy contamination of the chamber that required a lot of effort to clean and the process was not stable. | ||