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Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,760 edits
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[[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]]
[[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]]


The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate. It can also be used for Cr evaporation for the same purpose, and for evaporation of Ag, Au, Cu, and Ge. We have also attempted to evaporate Zn, but this resulted in heavy contamination of the chamber that required a lot of effort to clean and the process was not stable. If you would like to deposit other metals you are welcome to ask.
The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate. It can also be used for Cr evaporation for the same purpose, and evaporation of Ag, Au, Cu, and Ge. We have also attempted to evaporate Zn, but this resulted in heavy contamination of the chamber that required a lot of effort to clean and the process was not stable. If you would like to deposit other metals you are welcome to ask.


'''The user manual, APV, technical information and contact information can be found in LabManager:'''  
'''The user manual, APV, technical information and contact information can be found in LabManager:'''  
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