Specific Process Knowledge/Lithography/Strip: Difference between revisions

@@ Line 134: / Line 134: @@
 ! Process parameter !! [[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4|Resist stripping]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Descum (PA3)]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_4|Descum (PA4&5)]] !! Surface treatment !! Other ashing of organic material
 |-
-! scope=row| Process pressure
+! scope=row style="text-align: left;" | Process pressure
 | 1.3 mbar || 0.8 mbar || 1.3 mbar || 0.5-1.5 mbar || 0.5-1.5 mbar
 |-
-! scope=row| Process gasses
+! scope=row style="text-align: left;" | Process gasses
 |
 *O<sub>2</sub> (100 sccm)
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 *O<sub>2</sub>
 |-
-! scope=row| Process power
+! scope=row style="text-align: left;" | Process power
 | 1000 W || 100 W || 200 W || 150-1000 W || 150-1000 W
 |-
-! scope=row| Process time
+! scope=row style="text-align: left;" | Process time
 | 20-90 minutes || 1-10 minutes || 5-15 minutes || Seconds to minutes || Many hours, material dependent
 |-
-! scope=row| Substrate batch
+! scope=row style="text-align: left;" | Substrate batch
 | 1-25 || 1-2 || 1-25 || 1 || 1
 |}