Specific Process Knowledge/Lithography/Strip: Difference between revisions
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The ashing rate is related to the total gas flow rate during processing. | The ashing rate is related to the total gas flow rate during processing. | ||
Testing found that 200 sccm gives the highest ashing rate for both processing single substrates and when processing a full boat with 25 substrates. | Testing found that 200 sccm gives the highest ashing rate for both processing single substrates and when processing a full boat with 25 substrates. Please note that the ashing rate for a full boat is approximately ten times slower, than when processing a single substrate. | ||
'''Single substrate:'''<br> | '''Single substrate:'''<br> | ||