Specific Process Knowledge/Lithography/Strip: Difference between revisions

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 =Plasma Asher 5=
 [[File:PA5 front.jpg|320px|thumb|Plasma asher 5 in cleanroom E-5.|right]]
-<span style="color:red">Coming soon</span>
+The Plasma Asher 5 can be used for the following processes:
+*Photoresist stripping
+*Descumming
+*Surface cleaning
+*Removal of organic passivation layers and masks
+Furthermore plasma processing using CF<sub>4</sub> in plasma asher 5 can be used for:
+*Etching of glass and ceramic
+*Etching of SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub>, Si
+*Removal of polyimide layers
+Plasma asher 5 can be used for almost every material, but if you have any doubt if your materials are compatible/allowed in plasma asher 5, feel free to ask the lithography group at Nanolab.
+The user manual, risk assessment, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=531 LabManager] - '''requires login'''
+===Process Information===
+*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using Plasma Asher |SiO<sub>2</sub> etch using Plasma Asher 5]]
+*[[Specific Process Knowledge/Lithography/Descum#Plasma Asher 5|Descum using plasma asher 5]]
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