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| {{:Specific Process Knowledge/Lithography/Coaters/RCD8}} | | {{:Specific Process Knowledge/Lithography/Coaters/RCD8}} |
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| ==Spin Coater: RCD8==
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| [[Image:Spinner_RCD8_C-1.jpg|400px|thumb|Spin coater: RCD8 is located in C-1]]
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| '''Feedback to this section''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8 click here]'''
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| ''[[Specific_Process_Knowledge/Lithography/Coaters#Coater_Comparison_Table|Coater comparison table]]''
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| Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.
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| '''The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager]'''
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| ===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]===
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| [[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating|Spin coating]]
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| [[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Automatic dispense|Automatic dispense]]
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| [[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes|Recipes and templates]]
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| [[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results|Processing results]]
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| === Equipment performance and process related parameters ===
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| {| border="2" cellspacing="0" cellpadding="2"
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| !style="background:silver; color:black;" align="center" width="60"|Purpose
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black" align="center"|
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| *Spin coating of SU-8 resists
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| *Spin coating of PGMEA based AZ resists
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| *Spin coating of wafers with structured backside
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| *Edge bead removal
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| |-
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| !style="background:silver; color:black;" align="center" width="60"|Resist
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * manual dispense
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| * automatic dispense from syringe
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
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| |style="background:LightGrey; color:black"|Coating thickness
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * SU-8 resits: 0.1-200+ µm
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| * AZ 5214E: 1.5-3 µm
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| * AZ 4562: 8-15 µm
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| * AZ MiR 701: 1.5-3 µm
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| * AZ nLOF 2020: 2-3.5 µm
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
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| |style="background:LightGrey; color:black"|Spin speed
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| |style="background:WhiteSmoke; color:black" align="center"|
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| Vacuum chuck: 10 - 5000 rpm <br>
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| Non-vacuum chuck: Max. 3000 rpm
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| |-
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| |style="background:LightGrey; color:black"|Spin acceleration
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 10 - 3000 rpm/s <br>
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| Max. 1500 rpm/s with Gyrset
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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| |style="background:LightGrey; color:black"|Substrate size
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * 100 mm wafers
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| * 150 mm wafers (vacuum chuck only)
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| |-
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| | style="background:LightGrey; color:black"|Allowed materials
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| |style="background:WhiteSmoke; color:black" align="center"|
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| All cleanroom materials ?
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| |style="background:LightGrey; color:black"|Batch
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 1
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| |-
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| |}
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| <br clear="all" />
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| == Manual Spin Coaters == | | == Manual Spin Coaters == |
