Specific Process Knowledge: Difference between revisions
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2nd Level - Process Topic
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!Technique/Method | !Technique/Method | ||
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|[[Specific Process Knowledge/Characterization|Characterization]] | |rowspan="12" valign="top"|[[Specific Process Knowledge/Characterization|Characterization]] | ||
|Sample Imaging, XY dimensions | |Sample Imaging, XY dimensions | ||
|Microscopy: optical,SEM,AFM | |Microscopy: optical,SEM,AFM | ||
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|Sample Topography | |Sample Topography | ||
|AFM,Profiling with stylus or optical | |AFM,Profiling with stylus or optical | ||
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|Film thickness and optical constants | |Film thickness and optical constants | ||
|Ellipsometry,Reflectometry,Prism Coupling | |Ellipsometry,Reflectometry,Prism Coupling | ||
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|Film Stress | |Film Stress | ||
|Profiling with stylus or optical | |Profiling with stylus or optical | ||
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|Wafer thickness | |Wafer thickness | ||
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|Element analysis | |Element analysis | ||
|XPS,EDX,SIMS | |XPS,EDX,SIMS | ||
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|Contact Angle | |Contact Angle | ||
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|Resistivity | |Resistivity | ||
|Four point probe | |Four point probe | ||
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|Doping level/Carrier density | |Doping level/Carrier density | ||
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|Photoluminescence | |Photoluminescence | ||
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Revision as of 17:02, 10 November 2014
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