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Line 375: |
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| |7-up & Piranha | | |7-up & Piranha |
| |Removes organics and alkali ions | | |Removes traces of organics and alkali ions |
| |- | | |- |
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| |RCA | | |RCA |
| |Two step process to remove organics and metals | | |Two step process to remove traces of organics and metals |
| |- | | |- |
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| |IMEC | | |IMEC |
| |Removing dust, organics and alkali ions and slightly polish the surface. | | |Removing dust, traces of organics and alkali ions and slightly polish the surface. |
| Make the surface hydrophillic | | Make the surface hydrophillic |
| |- | | |- |
Revision as of 07:11, 17 October 2014
2nd Level - Process Topic
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Overview of sample processing
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Clean your sample
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Dry your sample
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Create a thin film on your sample
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Dope your sample
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Thermal treatment of your sample
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Make a mask on your sample
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Transfer pattern to your sample
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Define your structure directly
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Bond your samples together
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Characterize your sample
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Pack your sample
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Clean your sample
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Entry page in LabAdviser
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Techniques
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Materials
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Wafer cleaning
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Soap Sonic
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Removes dust and particles
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7-up & Piranha
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Removes traces of organics and alkali ions
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RCA
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Two step process to remove traces of organics and metals
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5% HF
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Removes native oxide
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IMEC
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Removing dust, traces of organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
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Dry your sample
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Entry page in LabAdviser
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Techniques
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Materials
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Wafer and sample drying
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Spin dryers
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Whole wafers
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Critial point dryer
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Sensitive wafers
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Create a layer/film on your sample
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Entry page in LabAdviser
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Techniques
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Materials
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Thermal Process/Oxidation
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Thermal oxidation
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Thermal SiO2
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Thin film deposition
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Sputter deposition
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Si,SiO2,Si3N3,TiO2, metals
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Thermal evaporation
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Al, ?
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E-beam evaporation
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Metals
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LPCVD
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Si3N4, SRN, SiO2, Si (poly and amorph)
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PECVD
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Si3N4, SiO2, PBSG
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Electroplating
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Ni
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Epitaxial growth /MOCVD
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?
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Lithography/Coaters
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Spin coating
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resists, polymers
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Spray coating
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resists, polymers
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Thermal treatment of your sample
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Entry page in LabAdviser
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Techniques
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Materials
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Thermal Process
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Annealing
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Si, PECVD layers
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Oxidation
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Si wafers
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Doping with B/P
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Si wafers
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Pyrolysis
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Resists?
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Rapid Thermal Anneal (RTP)
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?
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Make a mask on your sample
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Entry page in LabAdviser
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Techniques
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Materials
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Lithography
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Photolithography
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UV resists
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Deep UV lithography
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DUV resists
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E-beam lithography
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E-beam resists
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Imprinting
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Polymers
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Lift-off
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mostly used for making metal masks
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Transfer mask pattern to your sample
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Entry page in LabAdviser
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Techniques
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Materials
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Etch
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Wet etch
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Si, Glass, SiO2, Si3N4, Al, Cr, Ti, Au, Pt, InP, InGaAsP, GaAs/AlGaAs
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Dry etch
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Any material
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Lithography/Lift-off
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?
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Bond your samples together
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Entry page in LabAdviser
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Techniques
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Materials
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Bonding
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Eutectic bonding
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Fusion bonding
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Anodic bonding
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Characterize your sample
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Entry page in LabAdviser
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What do you need to measure?
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Technique/Method
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Characterization
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Sample Imaging, XY dimensions
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Microscopy: optical,SEM,AFM
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Sample Topography
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AFM,Profiling with stylus or optical
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Film thickness and optical constants
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Ellipsometry,Reflectometry,Prism Coupling
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Film Stress
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Profiling with stylus or optical
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Wafer thickness
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Element analysis
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XPS,EDX,SIMS
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Contact Angle
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Resistivity
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Four point probe
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Doping level/Carrier density
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Photoluminescence
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Pack your sample (back-end)
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Entry page in LabAdviser
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Techniques
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Materials
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Back-end processing
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Chip/die mounting
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Wire bonding
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Dicing
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jmli test