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!colspan="3" style="text-align:left;" | [[image:Define your structure directly.png|x100px|Define the structure directly on your sample]] Define your structure directly
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|LASER machining
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Revision as of 15:22, 16 July 2014
2nd Level - Process Topic
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Overview of sample processing 3
Clean your sample
Entry page in LabAdviser
Techniques
Materials
Wafer cleaning
Soap Sonic
Removes dust and particles
7-up & Piranha
Removes organics and alkali ions
RCA
Two step process to remove organics and metals
5% HF
Removes native oxide
IMEC
Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
Dry your sample
Entry page in LabAdviser
Techniques
Materials
Wafer and sample drying
Spin dryers
Whole wafers
Critial point dryer
Sensitive wafers
Create a layer/film on your sample
Entry page in LabAdviser
Techniques
Materials
Thermal Process/Oxidation
Thermal oxidation
Thermal SiO2
Thin film deposition
Sputter deposition
Si,SiO2,Si3N3,TiO2, metals
Thermal evaporation
Al, ?
E-beam evaporation
Metals
LPCVD
Si3N4, SRN, SiO2, Si (poly and amorph)
PECVD
Si3N4, SiO2, PBSG
Electroplating
Ni
Lithography/Coaters
Spin coating
resists, polymers
Spray coating
resists, polymers
Epitaxial growth
MOCVD
?
Thermal treatment of your sample
Entry page in LabAdviser
Techniques
Materials
Thermal Process
Annealing
Si, PECVD layers
Oxidation
Si wafers
Doping with B/P
Si wafers
Pyrolysis
Resists?
Make a mask on your sample
Entry page in LabAdviser
Techniques
Lithography
Photolithography
Deep UV lithography
E-beam lithography
Imprinting
Transfer mask pattern to your sample
Entry page in LabAdviser
Techniques
Materials
Etch
Wet etch
Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
Dry etch
Any material
Lift-off
?
Define your structure directly to your sample
Imprinting
LASER machining
Lithographic definition
Polymer Injection molding
Bond your samples together
Entry page in LabAdviser
Techniques
Materials
Characterize your sample
Entry page in LabAdviser
Techniques
Materials
Pack your sample (back-end)
Chip/die mounting
Wire bonding
Dicing
Overview of sample processing 4
Clean your sample
Entry page in LabAdviser
Techniques
Materials
Wafer cleaning
Soap Sonic
Removes dust and particles
7-up & Piranha
Removes organics and alkali ions
RCA
Two step process to remove organics and metals
5% HF
Removes native oxide
IMEC
Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
Dry your sample
Entry page in LabAdviser
Techniques
Materials
Wafer and sample drying
Spin dryers
Whole wafers
Critial point dryer
Sensitive wafers
Create a layer/film on your sample
Entry page in LabAdviser
Techniques
Materials
Thermal Process/Oxidation
Thermal oxidation
Thermal SiO2
Thin film deposition
Sputter deposition
Si,SiO2,Si3N3,TiO2, metals
Thermal evaporation
Al, ?
E-beam evaporation
Metals
LPCVD
Si3N4, SRN, SiO2, Si (poly and amorph)
PECVD
Si3N4, SiO2, PBSG
Electroplating
Ni
Epitaxial growth /MOCVD
?
Lithography/Coaters
Spin coating
resists, polymers
Spray coating
resists, polymers
Thermal treatment of your sample
Entry page in LabAdviser
Techniques
Materials
Thermal Process
Annealing
Si, PECVD layers
Oxidation
Si wafers
Doping with B/P
Si wafers
Pyrolysis
Resists?
Make a mask on your sample
Entry page in LabAdviser
Techniques
Lithography
Photolithography
Deep UV lithography
E-beam lithography
Imprinting
Transfer mask pattern to your sample
Entry page in LabAdviser
Techniques
Materials
Etch
Wet etch
Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
Dry etch
Any material
Lithography/Lift-off
?
Define your structure directly
Entry page in LabAdviser
Techniques
Materials
Imprinting
LASER machining
Lithographic definition
Polymer Injection molding
Bond your samples together
Entry page in LabAdviser
Techniques
Materials
Bonding
Eutectic bonding
Fusion bonding
Anodic bonding
Characterize your sample
Entry page in LabAdviser
Techniques
Materials
Pack your sample (back-end)
Chip/die mounting
Wire bonding
Dicing
jmli test