Specific Process Knowledge: Difference between revisions

From LabAdviser
Jump to navigation Jump to search
Line 35: Line 35:


===The section below here is under construction [[Image:section under construction.jpg|70px]] ===
===The section below here is under construction [[Image:section under construction.jpg|70px]] ===
==Overview of sample processing 2==
{| {{Table}}
|- valign="top"
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:cleaning.jpg|thumb|150px|Clean the sample]]
|}
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:drying.jpg|thumb|150px|Drying Samples ]]
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Making a layer 1.jpg|thumb|140px|Film Formation ]]
|-
|Thermal Oxide growth
|
|-
|Thin Film deposition
|
|-
|
|Sputter deposition
|-
|
|Thermal deposition
|-
|
|E-beam evaporation
|-
|CVD
|
|-
|
|LPCVD
|-
|
|PECVD
|-
|Coating
|
|-
|
|Spin coating
|-
|
|Spray coating
|-
|Electroplating
|
|-
|Epitaxial growth
|
|-
|}
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Thermal treatment 1.jpg|thumb|150px|Thermal treatment of the sample ]]
|}
|-
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Making a mask 1.jpg|thumb|140px|Make a mask on the sample ]]
|-
|Lithography
|-
|Imprinting
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Transfer pattern into the sample
|-
|Wet etch
|-
|Dry etch
|-
|Lift-off
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Direct structure definition
|-
|Imprinting
|-
|LASER machining
|-
|Lithographic definition
|-
|Polymer Injection molding
|-
|}
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Bonding samples together
|}
|-
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Characterize the sample
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Back end of the sample
|-
|Chip/die mounting
|-
|Wire bonding
|-
|Dicing
|-
|}
|
|
|-
|}


==Overview of sample processing 3==
==Overview of sample processing 3==

Revision as of 15:35, 15 July 2014

2nd Level - Process Topic

Feedback to this page: click here


Choose the process topic you are interested in

The section below here is under construction Section under construction.jpg

Overview of sample processing 3

Bond your samples together
Entry page in LabAdviser Techniques Materials
Characterize your sample
Entry page in LabAdviser Techniques Materials

Overview of sample processing 4


jmli test