Specific Process Knowledge

2nd Level - Process Topic

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Choose the process topic you are interested in

• Back-end processing

• Characterization

• Doping

• Etch

• Imprinting

• Lithography

• Thermal Process

• Thin film deposition

• Wafer and sample drying

• Wafer Bonding

• Wafer Cleaning

• Wafer Information

• III-V Process

Overview of sample processing 2

File:Cleaning.jpg Clean the sample	File:Drying.jpg Drying Samples	File:Making a layer 1.jpg Film Formation Thermal Oxide growth Thin Film deposition Sputter deposition Thermal deposition E-beam evaporation CVD LPCVD PECVD Coating Spin coating Spray coating Electroplating Epitaxial growth	File:Thermal treatment 1.jpg Thermal treatment of the sample
Make a mask on the sample Lithography Imprinting	Transfer pattern into the sample Wet etch Dry etch Lift-off	Direct structure definition Imprinting LASER machining Lithographic definition Polymer Injection molding	Bonding samples together
Characterize the sample	Back end of the sample Chip/die mounting Wire bonding Dicing

Overview of sample processing 3

Clean your sample Clean your sample Entry page in LabAdviser Techniques Materials Wafer cleaning Soap Sonic Removes dust and particles 7-up & Piranha Removes organics and alkali ions RCA Two step process to remove organics and metals 5% HF Removes native oxide IMEC Removing dust, organics and alkali ions and slightly polish the surface. Make the surface hydrophillic	File:Dry your sample.png Dry your sample Entry page in LabAdviser Techniques Materials Wafer and sample drying Spin dryers Whole wafers Critial point dryer Sensitive wafers	File:Create a film on your sample.png Create a layer/film on your sample Entry page in LabAdviser Techniques Materials Thermal Process/Oxidation Thermal oxidation Thermal SiO2 Thin film deposition Sputter deposition Si,SiO2,Si3N3,TiO2, metals Thermal evaporation Al, ? E-beam evaporation Metals LPCVD Si3N4, SRN, SiO2, Si (poly and amorph) PECVD Si3N4, SiO2, PBSG Electroplating Ni Lithography/Coaters Spin coating resists, polymers Spray coating resists, polymers Epitaxial growth MOCVD ?	File:Dope your sample.png Dope your sample Entry page in LabAdviser Techniques Materials Thin film deposition/PECVD PECVD Deposition of SiO2 or Si3N4 doped with P,B and Ge Thin film deposition/Furnace LPCVD PolySilicon LPCVD Deposition of PolySi doped with B or P Thermal Process/Dope with Boron Predeposition and drive-in Doping Silicon wafers with boron Thermal Process/Dope with Phosphorus Predeposition and drive-in Doping Silicon wafers with phosphorus Doping Ion implant ?
File:Thermal treat your sample.png Thermal treatment of your sample Entry page in LabAdviser Techniques Materials Thermal Process Annealing Si, PECVD layers Oxidation Si wafers Doping with B/P Si wafers Pyrolysis Resists?	File:Make a mask on your sample.png Make a mask on your sample Entry page in LabAdviser Techniques Lithography Photolithography Deep UV lithography E-beam lithography Imprinting	File:Transfer mask pattrn to your sample.png Transfer mask pattern to your sample Entry page in LabAdviser Techniques Materials Etch Wet etch Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs Dry etch Any material Lift-off ?	Define your structure directly to your sample Imprinting LASER machining Lithographic definition Polymer Injection molding
File:Bond your samples together.png Bond your samples together Entry page in LabAdviser Techniques Materials	File:Characterize your sample.png Characterize your sample Entry page in LabAdviser Techniques Materials	File:Pack your sample (back-end).png Pack your sample (back-end) Chip/die mounting Wire bonding Dicing

Overview of sample processing 4

Clean your sample Clean your sample Entry page in LabAdviser Techniques Materials Wafer cleaning Soap Sonic Removes dust and particles 7-up & Piranha Removes organics and alkali ions RCA Two step process to remove organics and metals 5% HF Removes native oxide IMEC Removing dust, organics and alkali ions and slightly polish the surface. Make the surface hydrophillic	Dry your sample Dry your sample Entry page in LabAdviser Techniques Materials Wafer and sample drying Spin dryers Whole wafers Critial point dryer Sensitive wafers	Create a layer/film on your sample Create a layer/film on your sample Entry page in LabAdviser Techniques Materials Thermal Process/Oxidation Thermal oxidation Thermal SiO2 Thin film deposition Sputter deposition Si,SiO2,Si3N3,TiO2, metals Thermal evaporation Al, ? E-beam evaporation Metals LPCVD Si3N4, SRN, SiO2, Si (poly and amorph) PECVD Si3N4, SiO2, PBSG Electroplating Ni Lithography/Coaters Spin coating resists, polymers Spray coating resists, polymers Epitaxial growth MOCVD ?
Dope your sample Dope your sample Entry page in LabAdviser Techniques Materials Thin film deposition/PECVD PECVD Deposition of SiO2 or Si3N4 doped with P,B and Ge Thin film deposition/Furnace LPCVD PolySilicon LPCVD Deposition of PolySi doped with B or P Thermal Process/Dope with Boron Predeposition and drive-in Doping Silicon wafers with boron Thermal Process/Dope with Phosphorus Predeposition and drive-in Doping Silicon wafers with phosphorus Doping Ion implant ?	Thermal treatment of your sample Thermal treatment of your sample Entry page in LabAdviser Techniques Materials Thermal Process Annealing Si, PECVD layers Oxidation Si wafers Doping with B/P Si wafers Pyrolysis Resists?	Make a mask on your sample Make a mask on your sample Entry page in LabAdviser Techniques Lithography Photolithography Deep UV lithography E-beam lithography Imprinting
Transfer mask pattern to your sample Transfer mask pattern to your sample Entry page in LabAdviser Techniques Materials Etch Wet etch Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs Dry etch Any material Lift-off ?	Define your structure directly Imprinting LASER machining Lithographic definition Polymer Injection molding	Bond your samples together Bond your samples together Entry page in LabAdviser Techniques Materials
Characterize your sample Characterize your sample Entry page in LabAdviser Techniques Materials	Pack your sample (back-end) Pack your sample (back-end) Chip/die mounting Wire bonding Dicing

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