Specific Process Knowledge: Difference between revisions
Appearance
| Line 283: | Line 283: | ||
|- | |- | ||
|[[Specific Process Knowledge/Doping|Doping]] | |||
|Ionimplant | |Ionimplant | ||
|? | |? | ||
|- | |- | ||
| Line 314: | Line 314: | ||
|} | |} | ||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | ||
! [[image:Make a mask on your sample.png|thumb| | ! [[image:Make a mask on your sample.png|thumb|150px|Make a mask on your sample]] | ||
|- | |- | ||
!Entry page in LabAdviser | !Entry page in LabAdviser | ||
Revision as of 08:57, 1 July 2014
Feedback to this page: click here
Choose the process topic you are interested in
The section below here is under construction 
Overview of sample processing 2
|
|
|
|
| ||||||||||||||||||||||||||||||
|
|
|
| ||||||||||||||||||||||||||||||
|
|
Overview of sample processing 3
| Entry page in LabAdviser | Techniques | Materials |
|---|---|---|
| Wafer cleaning | Soap Sonic | Removes dust and particles |
| 7-up & Piranha | Removes organics and alkali ions | |
| RCA | Two step process to remove organics and metals | |
| 5% HF | Removes native oxide | |
| IMEC | Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic |
| Entry page in LabAdviser | Techniques | Materials |
|---|---|---|
| Wafer and sample drying | Spin dryers | Whole wafers |
| Critial point dryer | Sensitive wafers |
| Entry page in LabAdviser | Techniques | Materials |
|---|---|---|
| Thermal Process/Oxidation | Thermal oxidation | Thermal SiO2 |
| Thin film deposition | ||
| Sputter deposition | Si,SiO2,Si3N3,TiO2, metals | |
| Thermal evaporation | Al, ? | |
| E-beam evaporation | Metals | |
| LPCVD | Si3N4, SRN, SiO2, Si (poly and amorph) | |
| PECVD | Si3N4, SiO2, PBSG | |
| Electroplating | Ni | |
| Lithography/Coaters | ||
| Spin coating | resists, polymers | |
| Spray coating | resists, polymers | |
| Epitaxial growth | MOCVD | ? |
| Entry page in LabAdviser | Techniques | Materials |
|---|---|---|
| Thin film deposition/PECVD | PECVD | Deposition of SiO2 or Si3N4 doped with P,B and Ge |
| Thin film deposition/Furnace LPCVD PolySilicon | LPCVD | Deposition of PolySi doped with B or P |
| Thermal Process/Dope with Boron | Predeposition and drive-in | Doping Silicon wafers with boron |
| Thermal Process/Dope with Phosphorus | Predeposition and drive-in | Doping Silicon wafers with phosphorus |
| Doping | Ionimplant | ? |
| Entry page in LabAdviser | Techniques | Materials |
|---|---|---|
| Entry page in LabAdviser | Techniques |
|---|---|
| Lithography | |
| Photolithography | |
| Deep UV lithography | |
| E-beam lithography | |
| Imprinting |
| Entry page in LabAdviser | Techniques | Materials |
|---|---|---|
| Etch | ||
| Wet etch | Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs | |
| Dry etch | Any material | |
| Lift-off | ? |
| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Entry page in LabAdviser | Techniques | Materials |
|---|---|---|
| Entry page in LabAdviser | Techniques | Materials |
|---|---|---|
| Chip/die mounting |
| Wire bonding |
| Dicing |
