Specific Process Knowledge: Difference between revisions
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==Overview of sample processing 3== | ==Overview of sample processing 3== | ||
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! [[image:Clean your sample.png|thumb|150px|Clean your sample]] | ! [[image:Clean your sample.png|thumb|150px|Clean your sample]] | ||
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|[[Specific Process Knowledge/Wafer cleaning|Specific Process Knowledge/Wafer cleaning]] | |[[Specific Process Knowledge/Wafer cleaning|Specific Process Knowledge/Wafer cleaning]] | ||
|Soap Sonic | |Soap Sonic | ||
| | |Removes dust and particles | ||
|- | |- | ||
| | | | ||
|7-up & Piranha | |7-up & Piranha | ||
| | |Removes organics and alkali ions | ||
|- | |- | ||
| | | | ||
|RCA | |RCA | ||
| | |Two step process to remove organics and metals | ||
|- | |- | ||
| | | | ||
|5% HF | |5% HF | ||
| | |Removes native oxide | ||
|- | |- | ||
| | | | ||
|IMEC | |IMEC | ||
| | |Removing dust, organics and alkali ions and slightly polish the surface. | ||
Make the surface hydrophillic | |||
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