Specific Process Knowledge: Difference between revisions

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==Overview of sample processing 3==
==Overview of sample processing 3==
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Clean your sample.png|thumb|150px|Clean your sample]]
! [[image:Clean your sample.png|thumb|150px|Clean your sample]]
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|[[Specific Process Knowledge/Wafer cleaning|Specific Process Knowledge/Wafer cleaning]]
|[[Specific Process Knowledge/Wafer cleaning|Specific Process Knowledge/Wafer cleaning]]
|Soap Sonic
|Soap Sonic
|Removing dust and particles
|Removes dust and particles
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|-
|
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|7-up & Piranha
|7-up & Piranha
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|Removes organics and alkali ions
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|-
|
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|RCA
|RCA
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|Two step process to remove organics and metals
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|-
|
|
|5% HF
|5% HF
|
|Removes native oxide
|-
|-
|
|
|IMEC
|IMEC
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|Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
|-
|-
|}
|}

Revision as of 07:19, 1 July 2014

2nd Level - Process Topic

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Overview of sample processing

Clean the sample
Drying Samples
Thermal treatment of the sample
Bonding samples together
Characterize the sample

Overview of sample processing 2

Clean the sample
Drying Samples
Thermal treatment of the sample
Bonding samples together
Characterize the sample

Overview of sample processing 3

Dry your sample
Entry page in LabAdviser Techniques Materials
Thermal treatment of your sample
Entry page in LabAdviser Techniques Materials
Bond your samples together
Entry page in LabAdviser Techniques Materials
Characterize your sample
Entry page in LabAdviser Techniques Materials