Specific Process Knowledge: Difference between revisions
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2nd Level - Process Topic
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==Overview of sample processing 3== | ==Overview of sample processing 3== | ||
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! Clean your sample | ! [[image:Clean your sample.png|thumb|150px|Clean your sample]] | ||
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! Dry your | ! [[image:Dry your sample.png|thumb|150px|Dry your sample]] | ||
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Revision as of 13:35, 27 June 2014
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Choose the process topic you are interested in
The section below here is under construction 
Overview of sample processing
Clean the sample 
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Drying Samples 
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Make a layer on the sample or Film Formation 
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| Thermal Oxide growth | |
| Physical Vapour Deposition | |
| Sputter deposition | |
| Thermal deposition | |
| E-beam evaporation | |
| CVD | |
| LPCVD | |
| PECVD | |
| Coating | |
| Spin coating | |
| Spray coating | |
| Electroplating | |
| Epitaxial growth |
Thermal treatment of the sample 
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Make a mask on the sample 
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| Lithography |
| Imprinting |
| Transfer pattern into the sample |
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| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition |
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| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding samples together |
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| Characterize the sample |
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| Back end of the sample |
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| Chip/die mounting |
| Wire bonding |
| Dicing |
Overview of sample processing 2
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Overview of sample processing 3
| Create a layer/film on your sample | ||
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| Entry page in LabAdviser | Techniques | Materials |
| Thermal Process/Oxidation | Thermal oxidation | Thermal SiO2 |
| Thin film deposition | ||
| Sputter deposition | Si,SiO2,Si3N3,TiO2, metals | |
| Thermal evaporation | Al, ? | |
| E-beam evaporation | Metals | |
| LPCVD | Si3N4, SRN, SiO2, Si (poly and amorph) | |
| PECVD | Si3N4, SiO2, PBSG | |
| Electroplating | Ni | |
| Lithography/Coaters | ||
| Spin coating | resists, polymers | |
| Spray coating | resists, polymers | |
| Epitaxial growth | MOCVD | ? |
| Dope your sample | ||
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| Entry page in LabAdviser | Techniques | Materials |
| Thin film deposition/PECVD | PECVD | Deposition of SiO2 or Si3N4 doped with P,B and Ge |
| Thin film deposition/Furnace LPCVD PolySilicon | LPCVD | Deposition of PolySi doped with B or P |
| Thermal Process/Dope with Boron | Predeposition and drive-in | Doping Silicon wafers with boron |
| Thermal Process/Dope with Phosphorus | Predeposition and drive-in | Doping Silicon wafers with phosphorus |
| Ionimplant | ? |
| Thermal treatment of your sample |
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| Make a mask on your sample | |
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| Entry page in LabAdviser | Techniques |
| Lithography | |
| Photolithography | |
| Deep UV lithography | |
| E-beam lithography | |
| Imprinting |
| Transfer mask pattern to your sample | ||
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| Entry page in LabAdviser | Techniques | Materials |
| Etch | ||
| Wet etch | Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs | |
| Dry etch | Any material | |
| Lift-off | ? |
| Define your structure diretly (no mask) |
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| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bond your samples together |
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| Characterize your sample |
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| Back end processing of your sample |
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| Chip/die mounting |
| Wire bonding |
| Dicing |