Specific Process Knowledge/Lithography: Difference between revisions

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@@ Line 105: / Line 105: @@
 =Equipment and Process Pages=
-{| style="color: black;" width="90%"
+{| style="border-collapse: separate; border-spacing: 1; border:none;padding:0"; cellpadding="10"; cellspacing="5"; width="100%";
-| colspan="3" |
 |-
-| style="width: 20%"|
+| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
-'''<big>[[Specific Process Knowledge/Lithography/Resist|Resist]]</big>'''
+'''<big><div class="center">Pre-lithography steps</div></big>'''
+'''[[Specific Process Knowledge/Lithography/Resist|Resist]]'''
 *[[Specific_Process_Knowledge/Lithography/Resist#User_resist_bottles_in_the_cleanroom|User bottles in the cleanroom]]
 *[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist|UV Resist]]
@@ Line 116: / Line 117: @@
 *[[Specific_Process_Knowledge/Lithography/Resist#Imprint_Resist|Imprint Resist]]
-'''<big>[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]</big>'''
+'''[[Specific Process Knowledge/Lithography/Pretreatment|Substrate Pre-treatment]]'''
 *[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
 *[[Specific Process Knowledge/Lithography/Pretreatment#Buffered_HF-Clean|BHF]]
 *[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]
-'''<big>[[Specific Process Knowledge/Lithography/Coaters|Coating]]</big>'''
+| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
+'''<big><div class="center">Coating methods and soft/hard baking</div></big>'''
+'''[[Specific Process Knowledge/Lithography/Coaters|Coating]]'''
 *[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
 *[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin Coater: Süss Stepper]]
@@ Line 129: / Line 133: @@
 *[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]
-'''<big>[[Specific Process Knowledge/Lithography/Baking|Baking]]</big>'''
+'''[[Specific Process Knowledge/Lithography/Baking|Baking]]'''
 *[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
 *[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]
-| style="width: 20%"; valign="top"|
+| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
-'''<big>[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]</big>'''
+'''<big><div class="center">Exposure methods</div></big>'''
+'''[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]'''
 *[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-1|Aligner: MA6-1]]
 *[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-2|Aligner: MA6-2]]
@@ Line 143: / Line 149: @@
 *[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_04|Aligner: Maskless 04]]
-'''<big>[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]</big>'''
+'''[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]'''
 *[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#DUV_Stepper|DUV Stepper (Canon FPA-3000EX4)]]
-'''<big>[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]</big>'''
+'''[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]'''
 *[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_9500_User_Guide|JEOL 9500]]
 *[[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith Eline]]
-'''<big>[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]</big>'''
+'''[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]'''
 *[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
 *[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]
+| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
+'''<big><div class="center">Development methods</div></big>'''
-| style="width: 20%"; valign="top"|
+'''[[Specific Process Knowledge/Lithography/Development|Development]]'''
-'''<big>[[Specific Process Knowledge/Lithography/Development|Development]]</big>'''
 *[[Specific_Process_Knowledge/Lithography/Development#Manual_beaker_development_in_fumehood|Manual beaker development]]
 *[[Specific_Process_Knowledge/Lithography/Development#Developer:_SU8_(Wet_Bench)|Developer: SU8 (Wetbench)]]
@@ Line 164: / Line 171: @@
 *[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
-'''<big>[[Specific Process Knowledge/Lithography/Descum|Descum]]</big>'''
+| style="border-radius: 10px; background: #f9f9f9; border: 1px #aaa solid; width: 20%"; valign="top" |
+'''<big><div class="center">Post-lithography steps</div></big>'''
+'''[[Specific Process Knowledge/Lithography/Descum|Descum]]'''
 *[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Plasma Asher 3: Descum]]
 *[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_4|Plasma Asher 4]]
@@ Line 170: / Line 180: @@
 *[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]]
-'''<big>[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]</big>'''
+'''[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]'''
 *[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]
-'''<big>[[Specific Process Knowledge/Lithography/Strip|Strip]]</big>'''
+'''[[Specific Process Knowledge/Lithography/Strip|Strip]]'''
 *[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3: Descum]]
 *[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_4|Plasma Asher 4]]