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Specific Process Knowledge/Lithography/Strip: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,716 edits
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'''Process parameter impact on ashing rate'''<br>
'''Process parameter impact on ashing rate'''<br>
Investigating the ashing rate using linear regression models on the process parameters, indicates that the gas mix and the chamber pressure has a significant impact on the ashing rate, while the gas flow has only little effect:
Processing a single substrate using the standard descum settings will provide users with a relatively controllable and uniform process. Adding dummy substrates in close proximity with the process substrate will reduce the ashing rate and improve the uniformity:
<gallery mode="packed-hover" heights="150">
<gallery mode="packed-hover" heights="150">
ParamEffect_100_mm_v1.png|100 mm process parameter impact
PA_descum_compareAmount_v1.png|Ashing amount
ParamEffect_150_mm_v1.png|150 mm process parameter impact
PA_descum_compareRate_v1.png|Ashing rate
ParamEffect_200_mm_v1.png|200 mm process parameter impact
PA_descum_compareUniformity_v1.png|Non-uniformity
</gallery>
</gallery>


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