Specific Process Knowledge/Lithography/Strip: Difference between revisions
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The Plasma Asher 3: Descum is dedicated for resist descum, i.e. removal of remains resist traces after development. It has a small chamber, so you can only load a single 100 mm substrate, or a few smaller pieces. | The Plasma Asher 3: Descum is dedicated for resist descum, i.e. removal of remains resist traces after development. It has a small chamber, so you can only load a single 100 mm substrate, or a few smaller pieces. | ||
In this machine, only Oxygen | In this machine, only Oxygen is used for processing. | ||
<b>Typical process parameters:</b><br> | <b>Typical process parameters:</b><br> | ||