Specific Process Knowledge/Lithography/Strip: Difference between revisions
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Be sure to wait for chamber to cool down to room temperature, before runinng descum processes in plasma asher 1 or 2. At a load of 2 Fused silica wafers, the amount of resist removed will be 10 - 1500 nm. | Be sure to wait for chamber to cool down to room temperature, before runinng descum processes in plasma asher 1 or 2. At a load of 2 Fused silica wafers, the amount of resist removed will be 10 - 1500 nm. | ||
'''NB: Use dedicated descum asher Plasma Asher | '''NB: Use dedicated descum asher Plasma Asher 3: Descum for descumming.''' | ||
==Plasma Asher 1== | ==Plasma Asher 1== | ||