Revision as of 15:21, 15 December 2022

The DREM processes

**DREM 2kW micro**
Recipe	General							Pressure						Gases																Generators						Matching								Tem- pera- ture	Results
	General							Pressure						C₄F₈						SF₆						O₂		Ar		Coil		Platen				Coil				Platen					Results
	Platen		Stb	S/E	Dp	Et	Cyc	Dp			Et			Dp			Et			Dp			Et			Dp	Et	Dp	Et	Dp	Et	Dp	Et			Dp		Et		Dp		Et			Runs	Keywords
	U/D	H/L	Stb	S/E	Dp	Et	Cyc	D	B	M	D	B	M	D	B	M	D	B	M	D	B	M	D	B	M	Dp	Et	Dp	Et	Dp	Et	Dp	D	B	M	L	T	L	T	L	T	L	T		Runs	Keywords
DREM 2kW micro	Pump to base, Clamp Substrate, home platen matching unit, stabilisation																																												8
DREM 2kW micro	U	HF		D/E	1.2	3				100%			100%	0.3@5	0.5@50	200	0.5@100		5	0.3@200	0.5@200	15	2@15	0.3@100	200			150	150	2	2	1	1@1	1@100	1	40	50	40	50	32.5	51.9	32.5	51.9	0	8
DREM 2kW micro	Pump to base, Clamp Substrate, home platen matching unit, stabilisation																																												1
DREM 2kW micro	U	HF		D/E	1.2	3				100%			100%	0.3@5	0.5@50	200	0.5@100		5	0.3@200	0.5@200	15	2@15	0.3@100	200			150	150	2	2	1	1@1	1@100	1	40	50	40	50	32.5	51.9	32.5	51.9	-19	1

0 Home matching
	General	Time	Pressure	Gas	" >Power	Matching	Miscellaneous
Setting		90t	7T	sulf	yes, lots	lit	na

Front Image	-	-	-
Clean your sample	Dry your sample	Create a thin film on your sample	Dope your sample
Thermal treatment of your sample	Make a mask on your sample	Transfer pattern to your sample	Define your structure directly

Clean your sample
Entry page in LabAdviser	Techniques	Materials
Wafer cleaning	Soap Sonic	Removes dust and particles
	7-up & Piranha	Removes traces of organics and alkali ions
	RCA	Two step process to remove traces of organics and metals
	5% HF	Removes native oxide
	IMEC	Removing dust, traces of organics and alkali ions and slightly polish the surface. Make the surface hydrophillic

Create a layer/film on your sample
Entry page in LabAdviser	Techniques	Materials
Thermal Process/Oxidation	Thermal oxidation	Thermal SiO2
Thin film deposition	Sputter deposition	Metals: Al, Ti, Cr, Co, Ni, Cu, Mo, Pd, Ag, Sn, Ta, W, Pt, Au, Fe, Mg, Nb, Ru Semiconductors: Si, Ge, ZnO Oxides: SiO₂, ITO, TiO₂, Al₂O₃, MgO, Ta₂O₅ Cr₂O₃ Transparent Conducting Oxides: ITO, AZO Alloys: TiW, NiCr, AlTi, NiV, AlCu, CoFe, CuTi, FeMn, MnIr, NiCo, NiFe, YSZ
	Thermal evaporation	Al, Ge, Ag
	E-beam evaporation	Metals: Ti, Cr, Al, Ni, Pt, Au, Mo, Nb, Pd, Ag, Cu, W, Ta Semiconductors: Si, Ge Oxides: SiO₂, TiO₂ Alloys: NiCr, TiAl
	LPCVD	Si₃N₄, SRN, SiO₂, Si (poly and amorph)
	PECVD	Si₃N₄, SiO₂, PBSG
	MVD	FDTS
	Electroplating	Ni
	Epitaxial growth /MOCVD	Al, As, Ga, In, P. doping: Si, Zn
Lithography/Coaters	Spin coating	resists, polymers
Lithography/Coaters	Spray coating	resists, polymers

Dope your sample
Entry page in LabAdviser	Techniques	Materials
Doping	Ion implant	e.g. P, B, As
	PECVD	Deposition of SiO2 or Si3N4 doped with P,B and Ge
	LPCVD	Deposition of PolySi doped with B or P
	Predeposition and drive-in	Doping Silicon wafers with boron
	Predeposition and drive-in	Doping Silicon wafers with phosphorus

Thermal treatment of your sample
Entry page in LabAdviser	Techniques	Materials
Thermal Process	Annealing (>350C)	Si, PECVD layers, Al, BCB curing, Polymer
	Oxidation	Si wafers
	Doping with B/P	Si wafers
	Pyrolysis	Resists: AZ, SU8, PDMS
	Rapid Thermal Anneal (RTP)	SiO2, Si3N4, Ti, III-V
Lithography/Baking	Baking (<300dg)	baking resist and polymers

Make a mask on your sample
Entry page in LabAdviser	Techniques	Materials
Lithography	Pattern design & Mask fabrication
	Photolithography	UV resists
	Deep UV lithography	DUV resists
	E-beam lithography	E-beam resists
	Imprinting	Polymers

Transfer mask pattern to your sample
Entry page in LabAdviser	Techniques	Materials
Etch	Wet etch	Si, Glass, SiO2, Si3N4, Al, Cr, Ti, Au, Pt, InP, InGaAsP, GaAs/AlGaAs
Etch	Dry etch	Any material
Lithography/Lift-off	Lift-off	Most materials

Define your structure directly
Entry page in LabAdviser	Techniques	Materials
Direct Structure Definition	Polymer Injection molding	Topas, PP, PE, PS
	LASER micro machining	Silicon, Metal, Graphene (on silicon), Glass (Pyrex, fused silica), TOPAS, PMMA
	Dicing saw	Silicon, Glass (Pyrex, fused silica)
	Imprinting	TOPAS, PMMA
	Hot Embosser	Topas, PP, PE, PS, PC, PMMA, ...
Lithography definition	SU8, AZ resists

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 ! class="hideImage" width="150" | Transfer pattern to your sample [[file:jehanTransfer.png|130px|frameless ]]
 ! class="hideImage" width="150" | Define your structure directly [[file:jehandefine.jpg|130px|frameless ]]
-|-
-! class="hideImage" width="150" height="180px"|  Bond your samples together [[file:jehanBond.png|130px|frameless ]]
-! class="hideImage" width="150" | Characterize your sample  [[file:jehanCharacterize.png|130px|frameless ]]
-! class="hideImage" width="150" | Pack your sample  [[file:jehanPack.png|130px|frameless ]]
-! class="hideImage" width="150" | Process flow examples [[file:processflow_b.png|130px|frameless ]]
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-{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
-!colspan="3" style="text-align:left;" | [[image:Bond your samples together.png|x100px|Bond your samples together]] Bond your samples together
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-!Entry page in LabAdviser
-!Techniques
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-|rowspan="3" valign="top"|[[Specific Process Knowledge/Bonding|Bonding]]
-|Eutectic bonding
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-|Fusion bonding
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-|Anodic bonding
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-|[[Specific_Process_Knowledge/Etch/DryEtchProcessing/Bonding |Etch/DryEtchProcessing/Bonding]]
-|Temporary bonding of wafers or chips for dry etching
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-|}
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